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HARVARD Citation
Casavola, C. et al. (n.d.). Experimental Analysis of Thermo‐mechanical Behaviour of Electronic Components with Speckle Interferometry. Strain. pp. 497-506. [Online].
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Casavola, C. et al. (n.d.). Experimental Analysis of Thermo‐mechanical Behaviour of Electronic Components with Speckle Interferometry. Strain. pp. 497-506. [Online].