Grounds for grounding : a handbook from circuits to systems /: a handbook from circuits to systems. ([2023])

• Record Type: Book
• Further Information: Note: Elya B. Joffe and Kai-Sang Lock.
• Authors: Joffe, Elya B; Lock, Kai-Sang
• Contents: Author Biographies xxi -- Foreword xxiii -- Preface to the Second Edition xxv -- Acknowledgments xxvii -- 1 Overview 1 -- References 7 -- 2 Fundamental Concepts 9 -- 2.1 Maxwell’s Equations Demystified 9 -- 2.1.1 Fundamental Terms 11 -- 2.1.2 Maxwell’s Equations 13 -- 2.2 Boundary Conditions 27 -- 2.3 Intrinsic Inductance of Conductors and Interconnects 28 -- 2.3.1 Concept of Inductance 28 -- 2.3.2 Self-Inductance 29 -- 2.3.3 Mutual Inductance 31 -- 2.3.4 Partial Inductance 32 -- 2.3.5 External and Internal Inductance 36 -- 2.3.6 Conductors as Materials 37 -- 2.3.7 Skin Effect and Skin Depth 38 -- 2.3.8 Proximity Effect 43 -- 2.4 Nonideal Properties of Passive Circuit Components and Interconnects 47 -- 2.4.1 “Real-World” Resistors 49 -- 2.4.2 “Real-World” Capacitors 50 -- 2.4.3 Antiresonance of Parallel (Nonideal) Capacitors 52 -- 2.4.4 “Real-World” Inductors 55 -- 2.4.5 Interconnects (Wires and PCB Traces) 56 -- 2.5 Return Current Path Impedance 57 -- 2.5.1 How Current Flows 58 -- 2.5.2 What Path Should Return Currents Follow? 58 -- 2.5.3 Is the Shortest Path Always the Best? 60 -- 2.5.4 What If Alternate Paths Are Available? 60 -- 2.5.5 Equivalent Circuit Analysis 62 -- 2.5.6 Implication of the Principle 71 -- 2.6 Spectral Content of Signals 73 -- 2.6.1 Radiation Efficiency and Electrical Length 74 -- 2.6.2 Periodic Pulsed Signals 74 -- 2.6.3 Random (Aperiodic) Pulsed Signals 77 -- 2.6.4 Effect of Ringing on the Spectrum of Pulsed Signals 78 -- 2.6.5 Spectrum Conservation 81 -- 2.7 Transmission Line Fundamentals 84 -- 2.7.1 Transmission Line Definition 84 -- 2.7.2 Transmission Line Equations and Intrinsic Parameters 84 -- 2.7.3 The Dual View of Signals and Interconnects 86 -- 2.7.4 Transmission Line Termination and Loading Conditions 87 -- 2.8 Modes of Signal Propagation 91 -- 2.8.1 Differential-Mode and Common-Mode Signals 91 -- 2.8.2 Common-Mode Interference-Generation Mechanism and Its Mitigation 93 -- 2.8.3 Differential Signaling and Balanced Circuits 98 -- 2.8.4 Common-Mode (CM) to Differential-Mode (DM) Conversion 106 -- 2.8.5 Even- and Odd-Mode Impedances 109 -- 2.9 Interaction Between Sources to Radiated Fields 118 -- 2.9.1 Radiation from Current-Carrying Conductors 118 -- 2.9.2 Flux Cancellation, the Electromagnetics of Balancing 122 -- 2.9.3 Not all Common-Mode Currents are Bad … 125 -- 2.10 Out of Band Susceptibility in Solid-state Devices 126 -- 2.10.1 RFI Rectification Mechanism in p–n Junctions 126 -- 2.10.2 Digital and Linear IC Interference Susceptibility 129 -- 2.10.3 Susceptibility of Op-Amps to Ground-Coupled EMI 132 -- References 135 -- 3 The Grounds for Grounding 137 -- 3.1 Grounding, an Introduction 137 -- 3.1.1 “Grounding, ” One Term, Many Imports 137 -- 3.1.2 The Grounding Symbol – Adding to the Confusion 141 -- 3.1.3 Grounding—A Historical Perspective and the Evolution of the Term 144 -- 3.1.4 Grounding-Related Myths, Misconceptions, and Misapprehensions vs. Facts and Sensible Choices 147 -- Interconnected Equipment 149 -- 3.2 Objectives of Grounding 152 -- 3.2.1 Electrical Safety Grounding 153 -- 3.2.2 Grounding for Control of Electromagnetic Interference (EMI) 163 -- 3.2.3 Signal Grounding 166 -- 3.2.4 Summary of Grounding Objectives 169 -- References 170 -- 4 Fundamentals of Grounding Design 171 -- 4.1 Ground-Coupled Interference and Its Preclusion 171 -- 4.1.1 Grounding May Not Be the Solution; Rather, it is Part of the Problem 171 -- 4.1.2 The Good Earth 174 -- 4.1.3 Controlling Common-Impedance Interference Coupling 176 -- 4.2 Fundamental Grounding Schemes 186 -- 4.2.1 The Need for Different Schemes 186 -- 4.2.2 Fundamental Grounding Schemes 189 -- 4.2.3 Grounding Schemes in Complex Systems 208 -- 4.3 Grounding Trees 213 -- 4.3.1 Objectives and Basic Design Considerations 213 -- 4.3.2 Ground Tree Design Methodology 214 -- 4.4 Role of Isolated Switch-Mode Power Supplies in Grounding System Design 223 -- 4.4.1 Principle of Switch-Mode Power Supply Operation 224 -- 4.4.2 The Need for Isolation in Switch-Mode Power Supplies 227 -- 4.4.3 Isolation and Grounding in Switch-Mode Power Supplies 230 -- 4.4.4 Isolation Requirements and Testing 232 -- 4.5 Ground Loops 234 -- 4.5.1 Definition of a “Ground Loop” 235 -- 4.5.2 “Who’s Afraid of the Big Bad Loop?, ” or – Ground Loop Consequences 239 -- 4.5.3 Ground Loop Interference Coupling Mechanisms 240 -- 4.5.4 Ground Loop Interactions: Frequency Considerations in CM to DM Interference Conversion 250 -- 4.5.5 Resolving Ground Loop Problems 255 -- 4.6 Zoned Grounding 274 -- 4.6.1 Electromagnetic Topology 274 -- 4.6.2 The Zoning Concept as Applied to Grounding 276 -- 4.6.3 Zoning Compromises and Violation 277 -- 4.6.4 Impact of Zoning on Subsystem Grounding Architecture 278 -- 4.7 Equipment Enclosure and Signal Grounding 279 -- 4.7.1 External Signal and Safety Grounding Interconnects Between Enclosures 279 -- 4.7.2 Equipment DC Power, Signal, and Safety Grounding 280 -- 4.7.3 Power Distribution Grounding Schemes in Integrated Clustered Systems 281 -- 4.7.4 Grounding of Equipment Enclosure Shield 285 -- 4.8 Rack and Cabinet Subsystem Grounding Architecture 287 -- 4.8.1 Grounding Ground-Rules in Racks and Cabinets 287 -- 4.8.2 Ground Loops and Their Mitigation in Racks and Cabinets 289 -- 4.8.3 External Grounding of Racks and Cabinets 290 -- 4.9 Grounding Strategy Applied by System Size and Layout 292 -- 4.9.1 One Size Fits None 292 -- 4.9.2 Isolated System 292 -- 4.9.3 Clustered System 292 -- 4.9.4 Distributed System 294 -- 4.9.5 Nested-Distributed System 295 -- 4.9.6 Central System with Extensions 295 -- 4.9.7 Grounding Strategy by System Size and Layout – Summary and Case Study 295 -- References 298 -- 5 Bonding Principles 301 -- 5.1 Objectives of Bonding 301 -- 5.2 Bond Impedance Requirements 303 -- 5.3 Types of Bonds 305 -- 5.3.1 Direct Bonds 305 -- 5.3.2 Indirect Bonds 308 -- 5.3.3 Contact Impedance of Bonds 309 -- 5.3.4 Bonding Impedance Equivalent Circuit 310 -- 5.3.5 Bond Effectiveness 319 -- 5.3.6 Enhancing Bonding Effectiveness 322 -- 5.4 Surface Treatment 323 -- 5.4.1 Roughness of Mating Surface Conditions 323 -- 5.4.2 Surface Contaminants 323 -- 5.4.3 Surface Hardness 324 -- 5.4.4 Contact Pressure 324 -- 5.4.5 Bond Area 324 -- 5.5 Dissimilar Metals and Galvanic Corrosion Control 324 -- 5.5.1 Thermodynamic Basis of Galvanic Corrosion 328 -- 5.5.2 Electrochemical Series 333 -- 5.5.3 Galvanic Series 335 -- 5.5.4 Electrochemical Kinetics of Galvanic Corrosion – Blame it on Faraday 335 -- 5.5.5 Galvanic Couples 340 -- 5.5.6 Impact of Environment on Galvanic Corrosion 342 -- 5.5.7 Effects of Corrosion on EMC Performance 346 -- 5.5.8 Corrosion Protection and Control 351 -- 5.6 Bonding Verification 360 -- References 362 -- 6 Grounding in Power Transmission and Distribution Networks 365 -- 6.1 Introduction 365 -- 6.2 Overhead Transmission Lines 366 -- 6.3 Underground Power Cable Transmission and Distribution Networks 368 -- 6.4 Earth Fault and Ground Potential Rise 369 -- 6.5 Tolerable Step and Touch Voltages 371 -- 6.6 Earthing for High-Voltage Substations 372 -- 6.6.1 Bonding Requirements 372 -- 6.6.2 Principal Design Considerations 373 -- 6.7 Earthing for Power Distribution System 374 -- 6.7.1 Faults in Power Distribution Systems 374 -- 6.7.2 Electric Shock Hazards 377 -- 6.7.3 Methods of Earthing in Power Distribution Systems 379 -- 6.7.4 The Ungrounded System 380 -- 6.8 Earthing in Low-Voltage Distribution System 382 -- 6.8.1 TN-System 382 -- 6.8.2 TT System 386 -- 6.8.3 IT System 388 -- 6.8.4 Temporary Overvoltage in Low-Voltage Installations Due to Faults Between High-Voltage Systems and Earth 389 -- 6.8.5 Earthing Systems and EMC 392 -- 6.8.6 Requirements for the Installation of Equipment with High-Protective Earth Conductor Current 392 -- 6.8.7 Application of Residual Current Devices for Shock Protection 393 -- 6.9 Equipotential Bonding to Building Structures and Other Services 394 -- References 396 -- 7 Grounding for Generators, UPSs, VSDs, and Instrumentation 399 -- 7.1 Grounding for Generators 399 -- 7.1.1 Ungrounded Generator 400 -- 7.1.2 Resistance Grounding 400 -- 7.1.3 Grounding of Generators in Parallel Operation 403 -- 7.1.4 Grounding and Earth Fault Protection for Generators in Parallel Operation 404 -- 7.1.5 Nuisance Tripping of Generators in Parallel Operation – A Case Study 408 -- 7.1.6 Transfer Switching of Alternate Power Supplies 410 -- 7.2 Grounding for Uninterruptible Power Supplies 412 -- 7.2.1 Grounding Scheme for Static Double-Conversion UPS 413 -- 7.2.2 Grounding for Transformerless UPS 415 -- 7.3 Grounding for Variable Frequency Drives 416 -- 7.3.1 Stray Currents in VFDs 417 -- 7.3.2 VFD Cables 417 -- 7.4 Grounding Requirements for Instrumentation 418 -- 7.4.1 Grounding Practices for Instrumentation 418 -- 7.4.2 Grounding for Fieldbus Systems 419 -- 7.4.3 The Least You Need to Know 422 -- References 423 -- 8 Grounding for Lightning Protection Systems 425 -- 8.1 An Overview of the Lightning Phenomenon 425 -- 8.2 Lightning Attachment Point and Zones of Protection 426 -- 8.3 The Lightning Protection System 428 -- 8.3.1 The Air Termination Subsystem 428 -- 8.3.2 The Down Conductors 429 -- 8.3.3 The Earth Termination Network 431 -- 8.4 Application of Natural Earth Electrodes 433 -- 8.5 Reduction of the Transient Impedance of Earth Electrodes 433 -- 8.6 Protection Against Transferred, Touch, and Step Voltages 436 -- 8.7 Influence of LV Earthing Schemes on Lightning Overvoltage 438 -- 8.8 Separate or Integrated Electrical and Lightning Grounds 440 -- 8.9 Pitfalls in Earthing and Bonding 445 -- References 446 -- 9 Integrated Facility and Mobile/ Transportable Vehicle Grounding Systems 449 -- 9.1 Facility Grounding Subsystems 450 -- 9.1.1 Earth Electrode Subsystem (EESS) 450 -- 9.1.2 Fault Protection Subsystem (FPSS) 450 -- ...
• Edition: Second edition
• Publisher Details: Piscataway, NJ Hoboken, New Jersey : IEEE Press John Wiley & Sons, Inc
• Publication Date: 2023
• Extent: 1 online resource, illustrations
• Subjects: 621.317; Electric currents -- Grounding; Integrated circuits -- Design and construction; Electric currents -- Grounding; Integrated circuits -- Design and construction
• Languages: English
• ISBNs: 9781119770961; 9781119770947; 1119770947; 1119770963; 9781119770954; 1119770955
• Related ISBNs: 1119770939; 9781119770930
• Notes: Note: Includes bibliographical references and index.; Note: Description based on online resource; title from digital title page (viewed on January 04, 2023).
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.