Mechanical standardization of semiconductor devices. Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage Part 6-19, (30th June 2010)

Record Type:
Book
Title:
Mechanical standardization of semiconductor devices. Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage Part 6-19, (30th June 2010)
Main Title:
Mechanical standardization of semiconductor devices.
Authors:
British Standards Institution,
Issue Display:
Part 6
Part:
6
Issue Sort Value:
0000-0000-0000-0006
Publisher Details:
London : British Standards Institution
Publication Date:
2010
Extent:
1 online resource (18 pages)
Subjects:
602.1841
Standardization
Electronic equipment and components
Thermal testing
Concave
Heating tests
Surface mounting devices
Semiconductor devices
Convex
Curved
Integrated circuits
Dimensional measurement
Dimensions
Technical data sheets
Languages:
English
Related ISBNs:
9780580607585
ISSNs:
3017-2910
Access Rights:
Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
Access Usage:
Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
View Content:
Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:
British Library HMNTS - ELD.DS.749755
Ingest File:
16_013.xml