Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ) Part 6-20, (31st December 2010)

Record Type:
Book
Title:
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ) Part 6-20, (31st December 2010)
Main Title:
Mechanical standardization of semiconductor devices.
Authors:
British Standards Institution,
Issue Display:
Part 6
Part:
6
Issue Sort Value:
0000-0000-0000-0006
Publisher Details:
London : British Standards Institution
Publication Date:
2010
Extent:
1 online resource (16 pages)
Subjects:
602.1841
Surface mounting devices
Electronic equipment and components
Printed-circuit boards
Engineering drawings
Standardization
Electric connectors
Semiconductor devices
Drawings
Dimensions
Integrated circuits
Languages:
English
Related ISBNs:
9780580645662
ISSNs:
3019-0027
Access Rights:
Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
Access Usage:
Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
View Content:
Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:
British Library HMNTS - ELD.DS.746984
Ingest File:
16_008.xml