Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly Part 2-46, (16th April 2018)

Record Type:
Book
Title:
Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly Part 2-46, (16th April 2018)
Main Title:
Materials for printed boards and other interconnecting structures.
Authors:
British Standards Institution,
Issue Display:
Part 2
Part:
2
Issue Sort Value:
0000-0000-0000-0002
Publisher Details:
London : British Standards Institution
Publication Date:
2018
Extent:
1 online resource (28 pages)
Subjects:
602.1841
Testing
Copper (I) compounds
Printed-circuit boards
Circuits
Printed circuits
Languages:
English
Related ISBNs:
9780580992001
ISSNs:
3036-3352
Access Rights:
Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
Access Usage:
Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
View Content:
Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:
British Library HMNTS - ELD.DS.746731
Ingest File:
16_009.xml