Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Ball grid array (BGA) re-balling Part 4, (25th April 2018)

Record Type:
Book
Title:
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Ball grid array (BGA) re-balling Part 4, (25th April 2018)
Main Title:
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder.
Authors:
British Standards Institution,
Issue Display:
Part 4
Part:
4
Issue Sort Value:
0000-0000-0000-0004
Publisher Details:
London : British Standards Institution
Publication Date:
2018
Extent:
1 online resource (44 pages)
Subjects:
602.1841
Electronic components
Grids
Solders
Defence
Management
Languages:
English
Related ISBNs:
9780580973345
ISSNs:
3035-5587
Access Rights:
Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
Access Usage:
Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
View Content:
Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:
British Library HMNTS - ELD.DS.746462
Ingest File:
16_008.xml