Device embedding assembly technology. Guidelines. Accelerated stress testing of passive embedded circuit boards Part 2-7, (1st April 2019)

Record Type:
Book
Title:
Device embedding assembly technology. Guidelines. Accelerated stress testing of passive embedded circuit boards Part 2-7, (1st April 2019)
Main Title:
Device embedding assembly technology.
Authors:
British Standards Institution,
Issue Display:
Part 2
Part:
2
Issue Sort Value:
0000-0000-0000-0002
Publisher Details:
London : British Standards Institution
Publication Date:
2019
Extent:
1 online resource (16 pages)
Subjects:
602.1841
Assembly
Stress
Testing
Boards
Circuits
Languages:
English
Related ISBNs:
9780539033595
ISSNs:
3038-8756
Access Rights:
Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
Access Usage:
Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
View Content:
Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:
British Library HMNTS - ELD.DS.745442
Ingest File:
15_032.xml