BS EN 63378-3. Thermal standardization on semiconductor packages. Part 3. Thermal circuit simulation models of semiconductor packages for transient analysis (24th January 2022)

Record Type:: Book
Title:: BS EN 63378-3. Thermal standardization on semiconductor packages. Part 3. Thermal circuit simulation models of semiconductor packages for transient analysis (24th January 2022)
Main Title:: BS EN 63378-3. Thermal standardization on semiconductor packages.
Authors:: British Standards Institution,
Publisher Details:: London : British Standards Institution
Publication Date:: 2022
Extent:: 1 online resource (19 pages)
Subjects:: 602.1841
Semiconductor manufacture
Semiconductor materials
Semiconductor technology
Protection (thermal)
Resistance (thermal)
Stability (thermal)
Thermal measuring
Thermal diffusion
Languages:: English
ISSNs:: 3044-3234
Access Rights:: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
Access Usage:: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:: British Library HMNTS - ELD.DS.664918
Ingest File:: 08_015.xml