Thermal standardization on semiconductor packages. Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages Part 1, (11th January 2022)

Record Type:
Book
Title:
Thermal standardization on semiconductor packages. Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages Part 1, (11th January 2022)
Main Title:
Thermal standardization on semiconductor packages.
Authors:
British Standards Institution,
Issue Display:
Part 1
Part:
1
Issue Sort Value:
0000-0000-0000-0001
Publisher Details:
London : British Standards Institution
Publication Date:
2022
Extent:
1 online resource (24 pages)
Subjects:
602.1841
Standardization
Semiconductors
Packages
Thermal resistance
Accuracy
Languages:
English
Related ISBNs:
9780539171525
ISSNs:
3043-4821
Access Rights:
Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
Access Usage:
Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
View Content:
Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:
British Library HMNTS - ELD.DS.661193
Ingest File:
08_008.xml