Device embedding assembly technology. Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity Part 2-602, (20th August 2021)

Record Type:
Book
Title:
Device embedding assembly technology. Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity Part 2-602, (20th August 2021)
Main Title:
Device embedding assembly technology.
Authors:
British Standards Institution,
Issue Display:
Part 2
Part:
2
Issue Sort Value:
0000-0000-0000-0002
Publisher Details:
London : British Standards Institution
Publication Date:
2021
Extent:
1 online resource (18 pages)
Subjects:
602.1841
Components
Modules
Evaluation
Electronic equipment and components
Assembly
Languages:
English
Related ISBNs:
9780539046458
ISSNs:
3039-4768
Access Rights:
Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
Access Usage:
Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
View Content:
Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:
British Library HMNTS - ELD.DS.632706
Ingest File:
06_015.xml