Electrical connectors : design, manufacture, test, and selection /: design, manufacture, test, and selection. (2020)

• Record Type: Book
• Further Information: Note: Edited by Michael G. Pecht and San Kyeong.
• Editors: Pecht, Michael; Kyeong, San
• Contents: About the Editor List of Contributors preface 1. CONNECTORS 1.1. Challenges of Separable Connectors 1.2. Components of a Connector 1.2.1. Contact Springs 1.2.2. Contact Finishes 1.2.2.1. Noble Metal Contact Finishes 1.2.2.2. Non-noble Metal Contact Finishes 1.2.3. Connector Housing 1.2.4. Contact Interface 1.3. Connector Types 1.3.1. Board-to-Board Connectors 1.3.2. Wire/Cable-to-Wire/Cable Connectors 1.3.3. Wire/Cable-to-Board Connectors 1.4. Connector Terminology 2. CONNECTOR HOUSING 2.1. Mechanical Properties 2.2. Electrical Properties 2.3. Flammability 2.4. Temperature Rating 2.5. Housing Materials 2.5.1. Thermoplastic Polymers 2.5.1.1. Polyesters 2.5.1.2. Polyimides, Polyamide-imides, and Polyetherimides 2.5.1.3. Polyphenylene Sulfides 2.5.1.4. Polyether Ether Ketones 2.5.1.5. Liquid-crystalline Polymers 2.5.1.6. Comparison of Thermoplastic Polymers 2.5.2. Thermosetting Polymers 2.5.3. Additives to Housing Materials 2.5.4. Manufacturing of Housing Materials 3. CONTACT SPRING 3.1. Copper Alloys 3.1.1. Unified Number System (UNS) 3.1.2. Properties of Copper Alloys 3.2. Nickel Alloys 3.3. Conductive Elastomers 3.4. Contact Manufacturing 4. CONTACT PLATING 4.1. Noble Metal Plating 4.1.1. Gold 4.1.2. Palladium 4.1.3. Combination of Gold and Palladium 4.2. Non-noble Metal Plating 4.2.1. Silver 4.2.1.1. Characteristics of Silver as a Contact Finish 4.2.1.2. Potential Tarnish-Accelerating Factors 4.2.1.3. Use of Silver in Typical Connectors 4.2.1.4. Managing Silver Corrosion 4.2.2. Silver-Palladium Alloys 4.2.3. Nanocrystalline Silver Alloys 4.2.4. Silver-Bismuth Alloys 4.2.5. Tin 4.2.6. Nickel Contact Finishes 4.3. Underplating 4.4. Plating Process 4.4.1. Electrolytic Plating 4.4.2. Electroless Plating 4.4.3. Cladding 4.4.4. Hot Dipping 5. CONNECTOR INSERTION AND EXTRACTION 5.1. Insertion and Extraction Forces 5.2. Contact Retention 5.3. Contact Force and Deflection 5.4. Contact Wipe 6. CONTACT INTERFACE 6.1. Constriction Resistance 6.2. Contact Resistance 6.3. Other Factors Affecting Contact Resistance 6.4. Current Rating 6.5. Capacitance and Inductance 6.6. Bandpass and Bandwidth 7. THE BACK-END CONNECTION 7.1. Connection Through Soldering 7.2. Press-fit Connection 7.3. Crimping Connection 7.4. Insulation Displacement Connection 8. LOADS AND FAILURE MECHANISMS 8.1. Environmental Loads 8.1.1. Temperature 8.1.2. Vibration Load 8.1.3. Humidity 8.1.4. Contamination 8.1.5. Differential Pressure 8.2. Failure Mechanisms in Electrical Connectors 8.2.1. Silver Migration 8.2.2. Tin Whiskers 8.2.3. Corrosion Failure 8.2.4. Arc Formation 8.2.5. Creep Failure 8.2.6. Wear 8.2.7. Frictional Polymerization 8.3. Case Study by NASA: Electrical Connectors for Spacecraft 9. FRETTING IN CONNECTORS 9.1. Mechanisms of Fretting Failure 9.1.1. Material Factors That Affect Fretting 9.1.1.1. Contact Materials 9.1.1.2. Hardness 9.1.1.3. Surface Finish 9.1.1.4. Frictional Polymerization 9.1.1.5. Grain Size 9.1.1.6. Oxides 9.1.1.7. Coefficient of Friction 9.1.1.8. Electrochemical Factor 9.1.2. Operating Factors That Affect Fretting 9.1.2.1. Contact Load 9.1.2.2. Fretting Frequency 9.1.2.3. Slip Amplitude 9.1.2.4. Electric Current 9.1.3. Environmental Factors That Affect Fretting 9.1.3.1. Humidity 9.1.3.2. Temperature 9.1.3.3. Dust 9.2. Reducing the Damage of Fretting 9.2.1. Lubrication 9.2.2. Improvement in Design 9.2.3. Coatings 10. TESTING 10.1. Dielectric Withstanding Voltage Testing 10.2. Insulation Resistance Testing 10.3. Contact Resistance Testing 10.4. Current Rating 10.5. Electromagnetic Interference and Electromagnetic Compatibility Testing 10.6. Temperature Life Testing 10.7. Thermal Cycling Testing 10.8. Thermal Shock Testing 10.9. Steady-State Humidity Testing 10.10. Temperature Cycling with Humidity Testing 10.11. Corrosion 10.11.1. Dry Corrosion 10.11.2. Creep Corrosion 10.11.3. Moist Corrosion 10.11.4. Fretting Corrosion 10.12. Mixed Flowing Gas Testing 10.12.1. Battelle Labs MFG Test Methods 10.12.2. EIA MFG Test Methods: EIA 364-TP65A 10.12.3. IEC MFG Test Methods: IEC 68-2-60 Part 2 10.12.4. Telcordia MFG Test Methods: Telcordia GR-63-CORE Section 5.5 10.12.5. IBM MFG Test Methods: G1(T) 10.12.6. CALCE MFG Chamber Capability 10.13. Vibration 10.13.1. Mechanical Shock 10.13.2. Mating Durability 10.14. Highly Accelerated Life Testing 10.15. Environmental Stress Screening 11. SUPPLIER SELECTION: RELIABILITY CAPABILITY ASSESSMENT 11.1. Connector Reliability 11.2. Capability Maturity Models 11.3. Key Reliability Practices 11.3.1. Reliability Requirements and Planning 11.3.2. Trai
• Edition: 1st
• Publisher Details: Hoboken : Wiley-IEEE Press
• Publication Date: 2020
• Extent: 1 online resource
• Subjects: 621.3193; Electric connectors
• Languages: English
• ISBNs: 9781119679820
• Related ISBNs: 9781119679806
• Notes: Note: Description based on CIP data; resource not viewed.
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
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