Semiconductor devices. Micro-electromechanical devices. Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT) Part 27, (22nd July 2020)

Record Type:: Book
Title:: Semiconductor devices. Micro-electromechanical devices. Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT) Part 27, (22nd July 2020)
Main Title:: Semiconductor devices. Micro-electromechanical devices.
Authors:: British Standards Institution,
Issue Display:: Part 27
Part:: 27
Issue Sort Value:: 0000-0000-0000-0027
Publisher Details:: London : British Standards Institution
Publication Date:: 2020
Extent:: 1 online resource (20 pages)
Subjects:: 602.1841
Resonance
Vibration
Semiconductor devices
Thin-film devices
Semiconductor technology
Fatigue testing
Electromechanical devices
Integrated circuits
Test specimens
Electronic equipment and components
Test equipment
Bend testing
Languages:: English
Related ISBNs:: 9780580899096
ISSNs:: 3032-1849
Access Rights:: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
Access Usage:: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:: British Library HMNTS - ELD.DS.546322
Ingest File:: 03_159.xml