Mechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits Part 5, (15th September 1997)

• Record Type: Book
• Authors: British Standards Institution,
• Publisher Details: London : British Standards Institution
• Publication Date: 1997
• Extent: 1 online resource (38 pages)
• Subjects: 602.1841; Dimensional tolerances; Tape; Films (states of matter); Perforations; Mechanical behaviour of materials; Datum; Mechanical properties of materials; Dimensions; Standardization; Codes; Bonding; Electronic equipment and components; Holes; Electrical connections; Flexible materials; Integrated circuits; Semiconductor devices
• Languages: English
• Related ISBNs: 0580278123
• ISSNs: 0109-4344
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.