Mechanical standardization of semiconductor devices. Recommendations for tape automated bonding (TAB) of integrated circuits Part 5, (1st April 1992)

• Record Type: Book
• Authors: British Standards Institution,
• Publisher Details: London : British Standards Institution
• Publication Date: 1992
• Extent: 1 online resource (16 pages)
• Subjects: 602.1841; Integrated circuits; Perforations; Assembling; Tape; Mechanical behaviour of materials; Electrical connections; Mechanical properties of materials; Flexible materials; Electronic equipment and components; Spaced; Standardization; Dimensions; Semiconductor devices; Bonding
• Languages: English
• Related ISBNs: 058020250X
• ISSNs: 0026-1416
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.