The ESD control program handbook. (2020)

• Record Type: Book
• Further Information: Note: Jeremy M. Smallwood.
• Authors: Smallwood, J. M (Jeremy M.)
• Contents: Introduction Foreword Preface Acknowledgements 1 Definitions and Terminology 1.1 Scientific notation and SI unit prefixes 1.2 Charge, electrostatic fields and voltage 1.2.1 Charge 1.2.2 Ions 1.2.3 Dissipation and neutralization of electrostatic charge 1.2.4 Voltage (potential) 1.2.5 Electric or electrostatic field 1.2.6 Gauss’s Law 1.2.7 Electrostatic attraction (ESA) 1.2.8 Permittivity 1.3 Electric current 1.4 Electrostatic discharge (ESD) 1.4.1 ESD Models 1.4.2 ElectroMagnetic Interference (EMI) 1.5 Earthing, grounding and equipotential bonding 1.6 Power and Energy 1.7 Resistance, resistivity and conductivity 1.7.1 Resistance 1.7.2 Resistivity and conductivity 1.7.2.1 Surface resistivity and surface resistance 1.7.2.2 Volume resistance, volume resistivity and conductivity 1.7.3 Insulators, conductors, conductive, dissipative and antistatic materials 1.7.4 Point to point resistance 1.7.5 Resistance to ground 1.7.6 Combination of resistances 1.8 Capacitance 1.9 Shielding 1.10 Dielectric breakdown strength 1.11 Relative humidity and dew point References 2 The principles of static electricity and electrostatic discharge (ESD) control 2.1 Overview 2.2 Contact charge generation (triboelectrification) 2.2.1 The polarity and magnitude of charging 2.3 Electrostatic charge build-up and dissipation 2.3.1 A simple electrical model of electrostatic charge build-up 2.3.2 Capacitance is variable 2.3.3 Charge decay time 2.3.4 Conductors and insulators revisited 2.3.5 The effect of relative humidity 2.4 Conductors in electrostatic fields 2.4.1 Voltage on conducting and insulating bodies and surfaces 2.4.2 Electrostatic field in practical situations 2.4.3 Faraday cage 2.4.4 Induction: An isolated conductive object attains a voltage when in an electric field 2.4.1 Induction charging: An object can become charged by grounding it 2.4.2 Faraday pail and shielding of charges within a closed object 2.5 Electrostatic discharges 2.5.1 ESD (sparks) between conducting objects 2.5.2 ESD from insulating surfaces 2.5.3 Corona discharge 2.5.4 Other types of discharge 2.6 Common electrostatic discharge sources 2.6.1 ESD from the human body 2.6.2 ESD from charged conductive objects 2.6.3 Charged device ESD 2.6.4 ESD from a charged board 2.6.5 ESD from a charged module 2.6.6 ESD from charged cables 2.7 Electronic models of ESD 2.8 Electrostatic attraction (ESA) 2.8.1 ESA and particle contamination 2.8.2 Neutralisation of surface voltages by air ions 2.8.3 Ionisers 2.8.4 Rate of charge neutralisation 2.8.5 The region of effective charge neutralisation around an ioniser 2.8.6 Ioniser balance and charging of a surface by an unbalanced ioniser 2.9 Electromagnetic interference (EMI) 2.10 How to avoid ESD damage of components 2.10.1 The circumstances leading to ESD damage of a component 2.10.2 Risk of ESD damage 2.10.3 The principles of ESD control References Bibliography 3 ESD sensitive devices (ESDS) 3.1 What are ESD sensitive devices? 3.2 Measuring ESD Susceptibility 3.2.1 Modelling electrostatic discharges 3.2.2 Standard ESD susceptibility tests 3.2.3 ESD withstand voltage 3.2.4 Human Body Model component susceptibility test 3.2.5 System level Human Body ESD susceptibility test 3.2.6 Machine Model component susceptibility test 3.2.7 Charged Device Model component susceptibility test 3.2.8 Comparison of test methods 3.2.9 Failure criteria used in ESD susceptibility test 3.2.10 Transmission line pulse techniques 3.2.11 The relation between ESD withstand voltage and ESD damage 3.2.12 Trends in component ESD test 3.3 ESD susceptibility of components 3.3.1 Introduction 3.3.2 Latent failures 3.3.3 Built-in on-chip ESD protection and ESD protection targets 3.3.4 ESD sensitivity of typical components 3.3.5 Discrete devices 3.3.6 The effect of scaling 3.3.7 Package effects 3.4 Some common types of ESD damage 3.4.1 Failure mechanisms 3.4.2 Breakdown of thin dielectric layers 3.4.3 MOSFETs 3.4.4 Susceptibility to electrostatic fields and breakdown between closely spaced conductors 3.4.5 Semiconductor junctions 3.4.6 Field effect structures and non-conductive device lids 3.4.7 Piezoelectric crystals 3.4.8 Light emitting diodes 3.4.9 Magnetoresistive heads 3.4.10 MicroElectroMechanical Systems (MEMS) 3.4.11 Burnout of device conductors or resistors 3.4.12 Passive components 3.4.13 Printed circuit boards and assemblies 3.4.14 Modules and system components 3.5 System level ESD 3.5.1 Introduction 3.5.2 The relationship between system level immunity and component ESD withstand 3.5.3 Charged cable ESD (Cable Discharge Events) 3.5.4 System-Efficient ESD Design (SEED) References Bibliography 4.1 Why habits? 4.2 The basis of ESD protection 4.3 What is an ESDS? 4.4 Habit 1: Always handle ESD sensitive components within an ESD Protected Area (EPA) 4.4.1 What is an EPA? 4.4.2 Defining the EPA boundary 4.4.3 Marking the EPA boundary 4.4.4 What is an insignificant level of ESD risk? 4.4.5 What are the sources of ESD risk? 4.4.6 What ESD protection measures are needed in the EPA? 4.4.7 Who will decide what ESD protection measures are required? 4.5 Habit 2: Where possible avoid use of insulators near ESDS 4.5.1 What is an insulator? 4.5.2 Essential and non-essential insulators 4.5.3 Remove non-essential insulators from the vicinity of ESDS 4.6 Habit 3: Reduce ESD risks from essential insulators 4.6.1 What is an insulator? 4.6.1 Insulators cannot be grounded 4.6.2 What to do about ESD risk from essential insulators 4.6.3 Using ionisers to reduce charge levels on insulators 4.7 Habit 4: Ground conductors, especially people 4.7.1 What is a conductor? 4.7.2 Conductive, dissipative or insulative? 4.7.3 Properties of a conductor 4.7.4 Charge and voltage decay time 4.7.5 The importance of material contact resistance in protecting ESDS 4.7.6 Safety considerations 4.7.7 Elimination of ESD by grounding and equipotential bonding 4.7.8 Understanding the grounding (earth) system 4.7.9 Grounding personnel handling ESDS 4.7.10 Grounding ESD control equipment 4.7.11 What if a conductor cannot be grounded? 4.8 Habit 5: Protect ESDS using ESD packaging 4.8.1 Don’t take ordinary packaging materials into an EPA 4.8.2 The basic functions of ESD packaging 4.8.3 Only open ESD packaging within an EPA 4.8.4 Don’t put papers or other unsuitable material in a package with an ESDS 4.9 Habit 6: Train personnel to know how to use ESD control equipment and procedures 4.9.1 Why train people? 4.9.2 Who needs ESD training? 4.9.3 What training do they need? 4.9.4 Refresher training 4.10 Habit 7: Check and test to make sure everything’s working 4.10.1 Why do we need to check and test? 4.10.2 What needs to be tested? 4.10.3 ESD control product qualification</p&gt
• Edition: 1st
• Publisher Details: Hoboken : Wiley-IEEE Press
• Publication Date: 2020
• Extent: 1 online resource
• Subjects: 621.381044; Electronic apparatus and appliances -- Protection; Electric discharges; Electrostatics
• Languages: English
• ISBNs: 9781118694558
• Related ISBNs: 9781118694572; 9781118694565
• Notes: Note: Description based on CIP data; resource not viewed.
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