Assembly and Reliability of Lead-Free Solder Joints. (2020)

• Record Type: Book
• Further Information: Note: John H. Lau, Ning-Cheng Lee.
• Authors: Lau, John H; Lee, Ning-Cheng
• Contents: Solder Joints in Printed Circuit Board Assembly.- Solder Joints in Advanced Packaging.- Prevailing Lead-Free Materials.- Soldering Processes.- Advanced Specialty Flux Design.- Solder Joint Characterization.- Reliability Tests and Data Analyses of Solder Joints.- Design for Reliability and Failure Analysis of Solder Joints.
• Publisher Details: Singapore : Springer
• Publication Date: 2020
• Copyright Date: 2020
• Extent: 1 online resource (527 pages)
• Subjects: Engineering; Electronics; Microelectronics; Electronic circuits; Technology & Engineering -- Electronics -- Circuits -- General; Circuits & components; Technology & Engineering -- Electronics -- General; Electronics engineering
• Languages: English
• ISBNs: 9789811539206
• Related ISBNs: 9789811539190
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.