Advanced thermal stress analysis of smart materials and structures. (2020)

• Record Type: Book
• Further Information: Note: Zengtao Chen, Abdolhamid Akbarzadeh.
• Other Names: Chen, Zengtao; Akbarzadeh, Abdolhamid
• Contents: Intro; Preface; Contents; 1 Heat Conduction and Moisture Diffusion Theories; 1.1 Introduction; 1.2 Heat Conduction; 1.2.1 Fourier Heat Conduction; 1.2.1.1 Thermal Boundary Conditions; 1.2.1.2 Thermal Initial Conditions; 1.2.1.3 Thermal Interfacial Conditions; 1.2.2 Non-Fourier Heat Conduction; 1.2.2.1 Cattaneo-Vernotte Heat Conduction; 1.2.2.2 Dual-Phase-Lag Heat Conduction; 1.2.2.3 Three-Phase-Lag Heat Conduction; 1.2.2.4 Fractional Phase-Lag Heat Conduction; 1.2.2.5 Nonlocal Phase-Lag Heat Conduction; 1.3 Moisture Diffusion; 1.3.1 Fickian Moisture Diffusion 1.3.2 Non-Fickian Moisture DiffusionReferences; 2 Basic Problems of Non-Fourier Heat Conduction; 2.1 Introduction; 2.2 Laplace Transform and Laplace Inversion; 2.2.1 Fast Laplace Inverse Transform; 2.2.2 Reimann Sum Approximation; 2.2.3 Laplace Inversion by Jacobi Polynomial; 2.3 Non-Fourier Heat Conduction in a Semi-infinite Strip; 2.4 Nonlocal Phase-Lag Heat Conduction in a Finite Strip; 2.4.1 Molecular Dynamics to Determine Correlating Nonlocal Length; 2.4.1.1 Nonlocal Heat Conduction in Functionally Graded Materials; 2.5 Three-Phase-Lag Heat Conduction in 1D Strips, Cylinders, and Spheres 2.5.1 Effect of Bonding Imperfection on Thermal Wave Propagation2.5.2 Effect of Material Heterogeneity on Thermal Wave Propagation; 2.5.3 Thermal Response of a Lightweight Sandwich Circular Panel with a Porous Core; 2.6 Dual-Phase-Lag Heat Conduction in Multi-dimensional Media; 2.6.1 DPL Heat Conduction in Multi-dimensional Cylindrical Panels; 2.6.2 DPL Heat Conduction in Multi-dimensional Spherical Vessels; References; 3 Multiphysics of Smart Materials and Structures; 3.1 Smart Materials; 3.1.1 Piezoelectric Materials; 3.1.1.1 Potential Field Equations; 3.1.2 Magnetoelectroelastic Materials 3.1.2.1 Potential Field Equations3.1.2.2 Conservation Equations; 3.1.2.3 Fourier Heat Conduction and Fickian Moisture Diffusion; 3.1.3 Advanced Smart Materials; 3.2 Thermal Stress Analysis in Homogenous Smart Materials; 3.2.1 Solution for the a Thermomagnetoelastic FGM Cylinder; 3.2.2 Solution for Thermo-Magnetoelectroelastic Homogeneous Cylinder; 3.2.3 Benchmark Results; 3.3 Thermal Stress Analysis of Heterogeneous Smart Materials; 3.3.1 Solution Procedures; 3.3.2 Benchmark Results; 3.4 Effect of Hygrothermal Excitation on One-Dimensional Smart Structures; 3.4.1 Solution Procedure 3.4.2 MEE Hollow Cylinder3.4.3 MEE Solid Cylinder; 3.4.4 Benchmark Results; 3.5 Remarks; References; 4 Coupled Thermal Stresses in Advanced Smart Materials; 4.1 Functionally Graded Materials; 4.2 Hyperbolic Coupled Thermopiezoelectricity in One-Dimensional Rod; 4.2.1 Introduction; 4.2.2 Homogeneous Rod Problem; 4.2.2.1 Fundamental and Governing Equations; 4.2.3 Solution Procedure; 4.2.3.1 Solution in Laplace Domain; 4.2.3.2 Numerical Inversion of Laplace Transform; 4.2.4 Results and Discussion; 4.3 Hyperbolic Coupled Thermopiezoelectricity in Cylindrical Smart Materials; 4.3.1 Introduction
• Publisher Details: Cham : Springer
• Publication Date: 2020
• Extent: 1 online resource (313 pages)
• Subjects: 620.11296; Smart materials; Smart structures; Thermal stresses; Materials -- Thermal conductivity; Smart materials; Smart structures; Thermal stresses; Electronic books
• Languages: English
• ISBNs: 9783030252014; 3030252019
• Notes: Note: Includes bibliographical references.; Note: Print version record.
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.