Si-RF technology. ([2019])

• Record Type: Book
• Further Information: Note: Ayan Karmakar, Kamaljeet Singh.
• Other Names: Karmakar, Ayan; Singh, Kamaljeet
• Contents: Intro; Foreword; Preface; Acknowledgements; Contents; About the Authors; Abbreviations; 1 Silicon Implementation of Planar Topologies; 1.1 Microstrip and CPW Topologies; 1.2 Losses in Planar Topologies; 1.3 Substrate Selection; 1.4 Silicon Substrate and Associated Challenges; 1.5 Modeling Aspects; 1.6 Loss Compensation Techniques; 1.7 Summarization; References; 2 Fabrication Technologies; 2.1 Bulk and Surface Micromachining; 2.2 Wafer Bonding; 2.2.1 Anodic Bonding; 2.2.2 Eutectic Bonding; 2.3 Summarization; References; 3 Passive Circuits; 3.1 Planar Balun (Single-Band Topology) 3.1.1 Design Aspects3.1.2 Electromagnetic Analysis and Layout; 3.1.3 Effect of Substrate Resistivity; 3.1.4 Fabrication and Measured Results; 3.2 Power Divider (Multiband Topologies); 3.2.1 Dual-Band Power Divider; 3.2.2 Receiver Concept (Multiband Topology); 3.3 CPW-Microstrip Transition; 3.4 Summarization; References; 4 Planar Antenna; 4.1 Ultra-Wideband Topology; 4.1.1 Antenna Design; 4.1.2 Fabrication and Measured Results; 4.1.3 Time-Domain Analysis of the Proposed Monopole Antenna; 4.2 Micromachined Patch Antenna and Array Topology; 4.2.1 Antenna Design 4.2.2 Fabrication and Measured Results4.3 Summary; 4.4 MATLAB Program for Calculations of Patch Length and Width with Given Dimensions; References; 5 MEMS Switch; 5.1 Background; 5.2 RF-Switch Development; 5.2.1 Electrical Modeling; 5.2.2 Fabrication Process; 5.2.3 Test and Characterization; 5.3 Switched-Line Phase Shifter; 5.3.1 Bit Design; 5.3.2 CLR Model of Single-Bit Phase Shifter; 5.3.3 EM Simulation of the Individual Bit; 5.3.4 Fabricated Prototype; 5.3.5 Proposed Testing Methodology of Phase Shifter; 5.4 MATLAB Program; 5.5 Summary; References; 6 Packaging Concept in Radio Frequency 6.1 Standard RF Package Configuration6.2 Package Simulation; 6.2.1 Eigen-Mode Simulation; 6.2.2 Loss Characterization; 6.3 Proposed Modification; 6.4 Characterization; 6.5 Through-Silicon Via (TSV); 6.5.1 Modeling; 6.5.2 Process Establishment; 6.6 MATLAB Code; 6.7 Summary; References; Future Scope; Appendix A; Material Properties of Some Useful Metals and Dielectrics; Appendix B; Relaxation Time Estimation for Some Materials Used in RF/Microwave Applications; Appendix C; Tentative Etch Rate of Various Thin Films of in Wet and Dry Methods; Appendix D Readymade Chart for VSWR, Return Loss, and Reflection CoefficientAppendix E; Frequently used Equipments and Test Components in RF Domain
• Publisher Details: Singapore : Springer
• Publication Date: 2019
• Extent: 1 online resource (157 p.)
• Subjects: 621.38412; 621.39/5; Radio frequency integrated circuits; Electronic books
• Languages: English
• ISBNs: 9789811380518; 9811380511
• Related ISBNs: 9811380503; 9789811380501
• Notes: Note: Description based on online resource; title from digital title page (viewed on June 13, 2019).
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.