Dependable multicore architectures at nanoscale. ([2018])

• Record Type: Book
• Further Information: Note: Marco Ottavi, Dimitris Gizopoulos, Salvatore Pontarelli, editors.
• Editors: Ottavi, Marco; Gizopoulos, Dimitris; Pontarelli, Salvatore
• Contents: Foreword I; Foreword II; Foreword III; Preface; Contents; Contributors; Challenges; 1 Manufacturing Threats; Abstract; 1 Reliability Issues; 2 Process Variation; 2.1 Sources of Front-End Variability; 2.2 Process Variation in Emerging Technologies; 2.3 Process Variation Modelling; 3 Transistor Aging; 3.1 Bias Temperature Instability (BTI); 3.1.1 Deterministic RD Model; 3.1.2 Stochastic Atomistic Trap-Based Model; 3.1.3 Process Variation and Stochastic BTI: Are They Correlated?; 3.2 Hot Carrier Injection (HCI); 3.2.1 HCI Model; 3.3 Coupling Models for BTI and HCI Degradations. 3.4 Random Telegraph Noise (RTN)3.4.1 RTN Model; 3.5 Time-Dependent Dielectric Breakdown (TDDB); 3.5.1 SBD Model; 3.5.2 HBD Model; 4 Voltage Droop; 4.1 Voltage Droop Metrics and Important Parameters; 4.2 Voltage Droop Model; 5 Soft Error; 5.1 Sources of Radiation; 5.2 Basic Physical Mechanism of Soft Error; 6 Summary; References; 2 Dependability Threats; Abstract; 1 Introduction; 2 Fault Models; 2.1 Fault Classification and Modeling; 2.1.1 Fault Classification; 2.1.2 Fault Modeling; 2.2 Fault Models for Permanent Faults; 2.2.1 Behavioral Fault Models; 2.2.2 Functional Fault Models. 2.2.3 Structural Fault Models2.2.4 Switch Fault Models; 2.2.5 Geometric Fault Models; 2.2.6 Multiple Fault Models; 2.3 Transient and Intermittent Fault Models; 2.3.1 Origins of the Soft Errors; 2.3.2 Types of Soft Errors; 2.4 Fault Models for Modern Technologies; 2.4.1 Fault Models for Field Programmable Gate Arrays (FPGAs); 2.4.2 Fault Models for Network on Chip; 3 Aging and Lifetime Reliability; 3.1 Device-Level Failure Mechanisms; 3.1.1 Electromigration; 3.1.2 Time-Dependent Dielectric Breakdown; 3.1.3 Stress Migration; 3.1.4 Thermal Cycling; 3.1.5 Sum of Failure Rates. 3.2 Failure Distributions3.3 Modeling Reliability of a Component in Variable Working Conditions; 3.3.1 Practical Considerations on Reliability Computation; 3.3.2 Reliability Computation for Thermal Cycling; 3.4 Modeling Reliability of a Complex Multi-component System; 3.4.1 System Reliability Computation; 3.4.2 An Example of Reliability Computation of a Multi-Core System; 4 Metrics; References; 3 Application Scenarios; Abstract; 1 Dependability and Advancement of Hardware; 2 Military and Aerospace; 3 Surface Transportation Domain; 4 Energy Domain; 5 Medical and Healthcare; 6 Machine Domain. 7 Consumer Electronics8 Protection Against Counterfeiting and Different Hardware Security Issues; References; Solutions; 4 Manufacturing Solutions; Abstract; 1 Introduction; 2 Mitigation of Process Variation; 2.1 Classification; 2.2 Static Schemes; 2.3 Process Schemes; 2.4 Design Schemes; 2.5 Dynamic Schemes; 2.6 Hardware-Based Schemes; 2.7 Software-Based Schemes; 3 Mitigation of Transistor Aging; 3.1 Stress-Induced Leakage Current and Gate Oxide Breakdown; 3.2 Bias Temperature Instability; 3.3 Hot Carrier Degradation; 3.4 Self-heating Effect; 3.5 Root Cause 1: Interface Traps.
• Publisher Details: Cham : Springer
• Publication Date: 2018
• Copyright Date: 2018
• Extent: 1 online resource, color illustrations
• Subjects: 004.16; Engineering; Multiprocessors; Nanotechnology; COMPUTERS -- Computer Literacy; COMPUTERS -- Computer Science; COMPUTERS -- Data Processing; COMPUTERS -- Hardware -- General; COMPUTERS -- Information Technology; COMPUTERS -- Machine Theory; COMPUTERS -- Reference; Multiprocessors; Nanotechnology; Engineering; Circuits and Systems; Performance and Reliability; Quality Control, Reliability, Safety and Risk; Electronics and Microelectronics, Instrumentation; Processor Architectures; Technology & Engineering -- Quality Control; Technology & Engineering -- Electronics -- General; Computers -- Systems Architecture -- General; Systems analysis & design; Reliability engineering; Electronics engineering; Computer architecture & logic design; Systems engineering; Operating systems (Computers); System safety; Electronics; Computer science; Technology & Engineering -- Electronics -- Circuits -- General; Circuits & components; Electronic books
• Languages: English
• ISBNs: 9783319544229; 3319544225
• Related ISBNs: 9783319544212; 3319544217
• Notes: Note: Includes bibliographical references.; Note: Online resource; title from PDF title page (EBSCO, viewed September 12, 2017).
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.