Fundamentals of lead-free solder interconnect technology : from microstructures to reliability /: from microstructures to reliability. ([2014])

• Record Type: Book
• Further Information: Note: Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma.
• Authors: Lee, Tae-Kyu; Bieler, Thomas R; Kim, Choong-Un; Ma, Hongtao
• Contents: Introduction -- Interconnection : The Joint -- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys -- Microstructure Development; Solidification and Isothermal Aging -- Thermal Cycling Performance -- Mechanical Stability and Performance -- Chemical and Environment Attack -- Challenges in Future Generation Interconnects: Microstructure Again.
• Publisher Details: New York : Springer
• Publication Date: 2014
• Copyright Date: 2015
• Extent: 1 online resource
• Subjects: 621.381; Engineering; Lead-free electronics manufacturing processes; Solder and soldering; Lead-free electronics manufacturing processes; Solder and soldering; Technology & Engineering -- Material Science; Technology & Engineering -- Electronics -- Circuits -- General; Electronic devices & materials; Circuits & components; Electronics; Optical materials; Systems engineering; Technology & Engineering -- Electronics -- General; Electronics engineering; Electronic books
• Languages: English
• ISBNs: 9781461492665; 1461492661; 1461492653; 9781461492658
• Related ISBNs: 9781461492658
• Notes: Note: Includes bibliographical references and index.; Note: Online resource; title from PDF title page (SpringerLink, viewed November 13, 2014).
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.