Handbook of electronic package design. (2018)

• Record Type: Book
• Further Information: Note: Edited by Michael Pecht.
• Other Names: Pecht, Michael
• Contents: Introduction -- Electronic components -- Printed wiring board design and fabrication -- Electronic assemblies -- Interconnections and connectors -- Layout -- Thermal design analysis -- Thermomechanical analysis and design -- Design for vibration and shock -- Humidity and corrosion analysis and design -- Design for reliability -- Electronic materials and properties.
• Publisher Details: Place of publication not identified : CRC Press
• Publication Date: 2018
• Extent: 1 online resource (904 pages)
• Subjects: 621.381/046; Electronic packaging -- Handbooks, manuals, etc; Electronic packaging; Elektronische Baugruppe; Halbleitergehäuse; Elektronische Baugruppe; Halbleitergehäuse; Handbooks and manuals; Handbooks and manuals
• Languages: English
• ISBNs: 9781351829977; 1351829971
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.