Materials for Advanced Packaging. (2017)

• Record Type: Book
• Further Information: Note: Edited by Daniel Lu, C.P. Wong.
• Editors: Lu, Daniel; Wong, C. P
• Other Names: École nationale supérieure des beaux-arts (France)
• Contents: 3D Integration Technologies – An Overview -- Advanced Bonding/Joining Techniques -- Advanced Chip-to-Substrate Connections -- Advanced Wire Bonding Technology: Materials, Methods, and Testing -- Lead-Free Soldering -- Thin Die Fabrication and Applications to Wafer Level System Integration -- Advanced Substrates: A Materials and Processing Perspective -- Flip-Chip Underfill: Materials, Process and Reliability -- New Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips -- Electrically Conductive Adhesives (ECAs) -- Die Attach Adhesives and Films -- Thermal Interface Materials -- Embedded Passives -- Advanced Bonding Technology Based on Nano- and Micro-metal Pastes -- Wafer Level Chip Scale Packaging -- MEMS Packaging -- LED Die Bonding -- Medical Electronics Design, Manufacturing, and Reliability -- Flexible and Printed Electronics -- Silicon Solar Cell Metallization Pastes -- Nano-metal Assisted Chemical Etching for Fabricating Semiconductor and Optoelectronic Devices -- Characterization of Copper Diffusion in Through Silicon Vias.
• Edition: 2nd ed. 2017
• Publisher Details: Cham : Springer International Publishing Imprint: Springer
• Publication Date: 2017
• Extent: 1 online resource (XVI, 969 pages), 700 illustartions, 440 illustrations in color
• Subjects: 621.381; Engineering; Nanotechnology; Electronics; Microelectronics; Electronic circuits; Optical materials; Electronics -- Materials; Metals; Engineering; Electronics and Microelectronics, Instrumentation; Nanotechnology and Microengineering; Metallic Materials; Optical and Electronic Materials; Circuits and Systems; Packaging -- Materials; Electronic circuits; Electronics; Electronics -- Materials; Engineering; Metals; Microelectronics; Nanotechnology; Optical materials; Technology & Engineering -- Nanotechnology & MEMS; Technology & Engineering -- Material Science; Technology & Engineering -- Electronics -- Circuits -- General; Precision instruments manufacture; Metals technology / metallurgy; Electronic devices & materials; Circuits & components; Materials; Systems engineering; Technology & Engineering -- Electronics -- General; Electronics engineering; Electronic books
• Languages: English
• ISBNs: 3319450980; 9783319450988; 9783319450971; 3319450972
• Notes: Note: Includes bibliographical references and index.; Note: Description based on print version record.
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.