Encapsulation technologies for electronic applications. (2018)
- Record Type:
- Book
- Title:
- Encapsulation technologies for electronic applications. (2018)
- Main Title:
- Encapsulation technologies for electronic applications.
- Authors:
- Ardebili, Haleh
Zhang, Jiawei
Pecht, Michael - Contents:
- 1. Introduction; 2. Plastic Encapsulant Materials; 3. Encapsulation Process Technology; 4. Characterization of Encapsulant Properties; 5. Encapsulation Defects and Failures; 6. Defect and Failure Analysis Techniques for Encapsulated Microelectronics; 7. Qualification and Quality Assurance; 8. Trends and Challenges
- Edition:
- Second edition
- Publisher Details:
- Norwich : William Andrew
- Publication Date:
- 2018
- Extent:
- 1 online resource
- Subjects:
- 621.381046
Electronic apparatus and appliances -- Plastic embedment - Languages:
- English
- ISBNs:
- 9780128119792
- Related ISBNs:
- 9780128119785
- Notes:
- Note: Description based on CIP data; resource not viewed.
- Access Rights:
- Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
- Access Usage:
- Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library HMNTS - ELD.DS.339101
- Ingest File:
- 01_286.xml