Mechanical analysis of electronic packaging systems. (1999)

• Record Type: Book
• Further Information: Note: Stephen A. Mckeown.
• Authors: Mckeown Stephen A
• Contents: Cover; Half Title; Title Page; Copyright Page; Dedication; Preface; Contents; Chapter 1: Introduction; 1.1 BACKGROUND; 1.1.1 Typical Electronic Packaging Configuration; 1.1.2 Electronic Packaging Levels; 1.1.3 Recent Development in Electronic Packaging; 1.1.4 Examples of Electronic Packaging Analysis; 1.2 PLANNING THE ANALYSIS; 1.2.1 Problem Definition/Objective; 1.2.2 Analysis Approach; 1.3 UNITS; 1.3.1 Background; 1.3.2 Acceleration Due to Gravity; 1.4 CONVENTIONS; 1.5 GENERAL ANALYSIS CHECKLIST; 1.5.1 Applicable to Analysis Planning; 1.5.2 Applicable to Units; 1.6 REFERENCES Chapter 2: Analytical Tools2.1 INTRODUCTION; 2.2 ANALYTICAL TOOLS; 2.2.1 Hand Calculations; 2.2.2 Symbolic Equation Solvers; 2.2.3 Spreadsheets; 2.2.4 Finite-Element Analysis; 2.2.5 Custom Programs; 2.3 SUMMARY OF ANALYTICAL TOOLS; 2.4 ""SEAMLESS"" AUTOMATION; 2.4.1 Background; 2.4.2 Custom Programs and Macros; 2.5 ANALYTICAL TOOL CHECKLIST; 2.5.1 Applicable to Hand Calculations; 2.5.2 Applicable to Symbolic Math Solvers; 2.5.3 Applicable to Spreadsheets; 2.5.4 Applicable to Finite-Element Analysis; 2.5.5 Applicable to Custom Programs; 2.6 REFERENCES; Chapter 3: Thermal Performance Analysis 3.1 BACKGROUND3.1.1 Steady-State Thermal Analysis; 3.1.2 Transient Thermal Analysis; 3.2 SELECTION OF ANALYSIS APPROACH; 3.3 THERMAL CONFIGURATION; 3.3.1 Thermal Path; 3.3.2 Thermal Masses; 3.3.3 Thermal Boundary Conditions; 3.3.4 Packaging Levels; 3.4 COlVIPONENT (FIRST) LEVEL; 3.4.1 Classical Methods; 3.4.2 Finite-Element Analysis; 3.4.3 Use of Published/Vendor Data; 3.5 PWB/MODULE (SECOND) LEVEL; 3.5.1 Identification of Thermal Path; 3.5.2 Classical Methods; 3.5.3 Finite-Element Analysis; 3.6 CHASSIS (THIRD) LEVEL; 3.6.1 Identification of Thermal Path; 3.6.2 Classical Methods 3.6.3 Finite-Element Analysis3.7 COMBINING ALL PACKAGING LEVELS; 3.7.1 Steady-State Thermal Analysis; 3.7.2 Transient Thermal Analysis; 3.7.3 Finite-Element Analysis Guidelines; 3.7.4 Typical Thermal Calculation; 3.8 SPECIAL THERMAL CASES; 3.8.1 Flow-through Modules; 3.8.2 Heat Pipes; 3.8.3 Thermoelectric Cooler; 3.8.4 Immersion Cooling; 3.8.5 Phase Change Material; 3.9 FACTORS IN RECENT DEVELOPMENTS; 3.10 VERIFICATION; 3.11 THERMAL ANALYSIS CHECKLIST; 3.11.1 Applicable to An Thermal Analyses; 3.11.2 Applicable to Transient Thermal Analysis; 3.11.3 Applicable to Finite·Element Analysis 3.11.4 Applicable to Special Heat Transfer Techniques3.11.5 Applicable to Recent Developments; 3.11.6 Environmental Data Required; 3.11.7 Material Properties Required; 3.12 REFERENCES; Chapter 4: Mechanical Performance Analysis; 4.1 BACKGROUND; 4.1.1 Static Mechanical Analysis; 4.1.2 Dynamic Mechanical Analysis; 4.2 SELECTION OF ANALYSIS APPROACH; 4.3 MECHANICAL MODELING; 4.3.1 Background; 4.3.2 Component Level; 4.3.3 Module Level; 4.3.4 Chassis Level; 4.3.5 Underlying Assumptions; 4.4 MECHANICAL DYNAMICS BACKGROUND; 4.4.1 Undamped Spring-Mass System
• Publisher Details: Boca Raton, FL : CRC Press
• Publication Date: 1999
• Extent: 1 online resource
• Subjects: 621.381046; Electronic packaging; Electronics; Mechanics; Electronic packaging; Electronics; Mechanics; Electronic books
• Languages: English
• ISBNs: 9781482293203
• Related ISBNs: 148229320X
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.