Handbook of semiconductor manufacturing technology. (©2008)

• Record Type: Book
• Further Information: Note: Edited by Robert Doering, Yoshio Nishi.
• Other Names: Doering, Robert, 1946-; Nishi, Yoshio, 1940-
• Contents: INTRODUCTION TO SEMICONDUCTOR DEVICES; John R. Hauser; Introduction; Overview of MOS Device Characteristics; MOSFET Device Scaling; Manufacturing Issues and Challenges; MOSFET Gate Stack Issues; Advanced MOS Device Concepts; Conclusions; References; OVERVIEW OF INTERCONNECT-COPPER AND LOW-κ INTEGRATION; Girish A. Dixit and Robert H. Havemann; Introduction; Dual Damascene Copper Integration; Copper/Low κ Reliability; Conclusion; References; SILICON MATERIALS; Wen Lin and Howard Huff; Introduction; Silicon Crystal Growth Processes; Characteristics of Czochralski Silicon Growth; Trends in Large Diameter Silicon Growth; Wafer Preparation; Epitaxial Growth; Oxygen Behavior in Silicon Processing; Other and New Applications of Silicon Materials; Summary; References; SOI MATERIALS AND DEVICES; Sorin Cristoloveanu and G.K. Celler; Introduction; SOI Basics: A Tutorial; SOI Wafer Fabrication Methods-Some Details; Advanced Wafer Engineering; Physical Characterization of SOI Wafers; Electrical Characterization; Partially Depleted SOI MOSFETs; Fully Depleted SOI MOSFETs; Scaling Trends; Multiple-Gate SOI MOSFETs; MEMS and Photonic Applications of SOI; Conclusions; Acknowledgements; References; SURFACE PREPARATION; Glenn W. Gale, Brian K. Kirkpatrick, and Frederick W. Kern Jr; RCA Clean; Electrochemistry; The Chemistry of Aqueous Solutions; SC-1; Complexing; Particle Removal; Particle Adhesion; Particle Removal-Chemical Undercutting; Particle Removal-Electrophoretic Effects and DLVO Theory; Particle Removal-Megasonics; Wet Chemical Etching; Oxide Etch; Hydrofluoric Acid and Metallic Contamination; Defects Related to Drying; Polysilicon Etch; Selective Nitride Etch; Oxide/Nitride Etch; Bulk Organic Removal/Photoresist Strip; Photolithography; Sulfuric/Oxidizer Chemistry; Reaction Mechanism; Sulfuric/Peroxide (PIRANHA); DI/OZONE; Surface Preparation and Cleaning for Interconnect; Subtractive Aluminum Interconnect; Key Subtractive Aluminum Cleaning Challenges with Associated Defects; Copper/Low-κ Dual Damascene Interconnect; Key Cu/Low-κ Challenges with Associated Defects; Typical Defects; Control and Monitoring of Surface Treatment Processes; References; SUPERCRITICAL CARBON DIOXIDE IN SEMICONDUCTOR CLEANING; Mohammed J. Meziani, Pankaj Pathak, and Ya-Ping Sun; Introduction; Supercritical Fluids; Supercritical CO2 Cleaning Processes; Processing Equipment; Conclusions and Perspectives; References; ION IMPLANTATION; Michael Ameen, Ivan Berry, Walter Class, Hans-Joachim Gossmann, and Leonard Rubin; Introduction; Ion Implant Physics and Materials Science; Applications of Ion Implantation; Commercial Ion Implantation Equipment; Process Control in Ion Implantation; References; DOPANT DIFFUSION; Sanjay Banerjee; Introduction; Definition of Point Defects; Thermodynamics of Defects; Migration and Diffusion of Point Defects; Fick's Laws of Diffusion; Equilibrium Formulation for Dopant Diffusion; Non-Equilibrium Formulation for Dopant Diffusion; Diffusion in Strained Silicon; Conclusions and Future Research; Acknowledgments; References; OXIDATION AND GATE DIELECTRICS; C. Rinn Cleavelin, Luigi Colombo, Hiro Niimi, Sylvia Pas, and Eric M. Vogel; Introduction to Oxidation and Gate Dielectric Technology; Oxidation Theory; Oxidation Interactions; Numerical Modeling of Oxidation; Metrology of Dielectric Films; Gate Dielectrics; Summary; References; SILICIDES; Christian Lavoie, Francois M. d'Heurle, and Shi-Li Zhang; Scope of the Chapter; Introduction; Development Trends of Silicide; Nickel Silicide for Contacts and Interconnections; Metal Gate and Schottky Barrier Source-Drain; Summary; Acknowledgments; References; RAPID THERMAL PROCESSING; P.J. Timans; Introduction; RTP System Hardware and Control Technology; Semiconductor Processing Using RTP; Conclusion; Acknowledgments; References; LOW-κ DIELECTRICS; Ting Y. Tsui and Andrew J. McKerrow; Introduction; Channel Crack Failures; Elastic Constraint Effects; Pattern Layout Effects; Environmental Effects; Conclusion; References; CHEMICAL VAPOR DEPOSITION; Li-Qun Xia and Mei Chang; Introduction: What Is CVD and Why CVD; Basic Aspects of CVD; CVD System Design; CVD Thin Films; References; ATOMIC LAYER DEPOSITION; Thomas E. Seidel; Introduction; ALD Origins; Chemical Processes; ALD System Technology; Applications; Summary of Current Status and Outlook; Acknowledgments; References; PHYSICAL VAPOR DEPOSITION; Stephen M. Rossnagel; Introduction and Semiconductor Applications; Sputtering Background and Basics; PVD Systems; Applications and Variations for Interconnect Applications; Summary, Future Directions; References; DAMASCENE COPPER ELECTROPLATING; Jonathon Reid; Introduction; Fundamentals of Electroplating; Damascene Cu Electroplating Chemistry; Damascene Film Deposition; Modeling Capabilities; Process Integration; Process Control Approaches; Acknowledgments; References; CHEMICAL-MECHANICAL POLISHING; Gregory B. Shinn, Vincent Korthuis, Gautum Grover, Simon Fang, and Duane S. Boning; Introduction; Equipment and Consumables; Mechanisms and Models; Applications and Issues; Post-CMP Clean; References; OPTICAL LITHOGRAPHY; Gene E. Fuller; Introduction; Patterning Basics; Optics for Manufacturing; Exposure Tool System Considerations; Resolution Enhancement Techniques; Manufacturing Considerations; Recent Advances in Optical Lithography; Patterning Roadmaps; Summary; References; PHOTORESIST MATERIALS AND PROCESSING; César M. Garza, Will Conley, and Jeff Byers; Formation of the Relief Image; Formation of a Relief Image in Novolac-Based Photoresists; Formation of the Relief Image in Chemically Amplified Resists; ArF Materials, Immersion Lithography, and Extension of ArF; References; PHOTOMASK FABRICATION; Syed A. Rizvi and Sylvia Pas; Introduction; Photomask: Structure and Fabrication; Writing Patterns on Masks; Materials and Processing; Photomask Qualification; Manufacturability and COO; References; PLASMA ETCH; Peter L.G. Ventzek, Shahid Rauf, and Terry Sparks; Introduction; Technical Basics of Plasmas Relevant to Plasma Etching; 65-90 nm CMOS Etch Process Modules; The Next Generation-45-32 nm Technology Nodes; Nanotechnology-22 nm and Beyond; Modeling of Plasma Etching Processes; References; EQUIPMENT RELIABILITY; Vallabh H. Dhudshia; Introduction; Reliability Metrics Calculations; Applications of Reliability Metrics; Confidence Limits Calculations; Precise Use of the Reliability Metrics; Maintainability Metrics; High-Level Equipment Performance Metrics; An Example of Reliability and High Level Performance Metrics Calculations; Four Steps to Better Equipment Reliability; Reliability Testing; Use of Equipment Reliability Discipline in Business Practices; SEMI E10; References; OVERVIEW OF PROCESS CONTROL; Stephanie Watts Butler; Introduction to Control of Systematic Yield Loss; The Control-Type Categories; History of Process Control in Semiconductor Manufacturing; Characterization of Control Needs in Semiconductor Manufacturing; Basic Concepts of all Control Techniques; Specific Abnormality Detection and Control Methods; Specific Compensation Control Methods; Monitoring the Supervisory Run-to-Run Controller and the Controller System (APC); Continuous Process Improvement; Summary; Acronyms and Glossary; References; Further Reading; IN-LINE METROLOGY; Alain C. Diebold; Introduction; Metrology for Lithography Processes: Critical Dimension Measurement and Overlay Control; Metrology for Front End Processes; Interconnect Process Control; In-FAB FIB; Acknowledgments; References; IN-SITU METROLOGY; Gabriel G. Barna and Brad VanEck; Introduction; Process State Sensors; Wafer-State Sensors; Measurement Techniques for Potential Sensors; Software for In-Situ Metrology; Use of In-Situ Metrology in SC Manufacturing; References; YIELD MODELING; Ron Ross and Nick Atchison; Introduction; Cluster Analysis; Yield Models; Yield Limits; Summary; References; YIELD MANAGEMENT; Loui
• Edition: 2nd ed
• Publisher Details: Boca Raton : CRC Press
• Publication Date: 2008
• Copyright Date: 2008
• Extent: 1 online resource (1 volume (various pagings)), illustrations
• Subjects: 621.3815/2; Semiconductors -- Design and construction -- Handbooks, manuals, etc; Semiconductor industry -- Handbooks, manuals, etc; TECHNOLOGY & ENGINEERING -- Electronics -- Solid State; TECHNOLOGY & ENGINEERING -- Electronics -- Semiconductors; Semiconductor industry; Semiconductors -- Design and construction; Halbleitertechnologie; Electronic books; Handbooks and manuals
• Languages: English
• ISBNs: 9781420017663; 1420017667
• Related ISBNs: 9781574446753; 1574446754
• Notes: Note: Includes bibliographical references and index.; Note: Print version record.
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.