Practical guide to the packaging of electronics : thermal and mechanical design and analysis /: thermal and mechanical design and analysis. (©2009)

• Record Type: Book
• Further Information: Note: Ali Jamnia.
• Other Names: Jamnia, Ali, 1961-
• Contents: INTRODUCTION ; Issues in Electronics Packaging Design ; Technical Management Issues ; Electronics Design ; Packaging / Enclosure Design ; Reliability ; BASIC HEAT TRANSFER: CONDUCTION, CONVECTION AND RADIATION ; Basic Equations and Concepts ; General Equations ; Non Dimensional Groups ; Nusselt Number ; Grashof Number ; Prandtl Number ; Reynolds Number ; CONDUCTIVE COOLING ; Thermal Resistance ; Sample Problem & Calculations ; Resistance Network ; Network Rules ; Sample Problem & Calculations ; Comparison with Exact Results ; Assumptions ; Temperature at Intermediate Points ; Exercise: IC Temperature Determination ; Heat Spreading ; Thermal Modeling; Example ; Applications ; Junction-to-Junction Case Resistance ; Contact Interface Resistance ; Modeling the Interface ; Exercise – Calculate the Component Temperature ; First Approach ; A Second Approach ; A Third Approach ; A Word on Edge Guides ; 2-D or 3-D Heat Conduction ; Thermal Conductance ; Example ; RADIATION COOLING ; Factors Influencing Radiation ; Surface Properties ; View Factor Calculations ; View Factor Calculations In Electronics Packages ; Examples and Illustrations ; Electronics Packaging Problem; Flow in a Vertical Open-ended Channel ; Cabinet Surface Temperature ; First Approach; Second Approach; FUNDAMENTALS OF CONVECTION COOLING ; Introduction ; Flow Regimes, Types & Influences ; Free (or natural) convection ; Estimates of Heat Transfer Coefficient ; Solution Procedure ; High Altitudes ; Board Spacing & Inlet-Outlet Openings ; Design Tips ; Cabinet Interior & Surface Temperature ; Calculating Surface Temperature ; Calculation of Internal Temperature ; Calculation of Component Temperature ; Fin Design ; Basic Procedure ; RF Cabinet Free Convection Cooling ; Analytical Approach ; Design Recommendations for This Example. ; A More Exact Procedure ; Forced Convection ; Direct Flow System Design ; Required Flow Rate ; Board Spacing & Configurations ; Flow Resistance ; Flow Networks ; Flow Rate Distribution Between Parallel Plates ; Optimum Board Spacing and Heat flow ; System’s Impedance Curve ; Sample Problem ; Fan-Selection, and Fan Laws ; Fan Performance Curve ; Fan Networks ; More on Fan Performance Curves ; Fan Laws ; Component Hot Spot ; Calculating hc Using Colburn Factor ; Calculating hc Using Flow Rate ; In-Direct Flow System Design ; Resistance Network Representation; COMBINED MODES AS WELL AS TRANSIENT HEAT TRANSFER ; Total System Resistance ; Time Dependent Temperature Variation ; Temperature Rise of an Electronic Module; BASICS OF VIBRATION AND ITS ISOLATION ; Periodic and Harmonic Motions ; Free Vibration ; First Application ; Example ; Second Application ; Mode Shapes ; Damped Vibration; Impact of Damping ; Forced Vibration ; Engineering Applications ; Dynamic Magnification Factor ; Transmissibility; Phase Angle ; Vibration Through Base Excitation ; Example ; Vibration Isolation ; Example 1 ; Example 2 ; Applications to Electronics Enclosures ; Maximum Deflection ; Typical Transmissibility Values in Electronics Enclosures ; Maximum Desired PCB Deflection ; Random Vibration ; Vibration Terminology; Peak Value ; Average Value ; Mean Square Value ; Root Mean Square (RMS) ; Decibel ; Octave ; Spectral Density ; Solution Techniques For Random Vibration; Excitation Spectrum ; Equipment Response ; Vibrations Due to Acoustics And Noise; Multiple Degree of Freedom Systems ; BASICS OF SHOCK MANAGEMENT ; Pulse Shock Isolation ; Example 1; Example 2; System without Isolators ; System with Isolators ; Velocity Shock Isolation ; Example; Maximum Desired PCB Deflection ; Equipment Design ; INDUCED STRESSES ; Forced Vibration ; Sample Problem; Random Vibration ; Probability of Failure; Example; Shock Environment ; THE FINITE ELEMENT METHODS ; Some Basic Definitions ; THE FINITE ELEMENT ANALYSIS PROCEDURE ; Finite Element Formulation ; Formulation of Characteristic Matrix and Load Vector ; Direct Approach; Variational (Energy) Approach; Weighted Residual Approach ; Finite Element Formulation of Dynamic Problems ; Wave Propagation Type; Vibration Type; Methods of Solving This Equation: Example; Impact of Boundary Conditions; Uniform Bar ; Finite Element Formulation of Heat Conduction ; CAD to FEA Considerations ; CAD to FEA, Do’s and Do Not’s; Criteria for Choosing an Engineering Software ; What types of Engineering programs are there?; Computer Aided Design (CAD) and Computer Aided Manufacturing (CAM) ; Solid Mechanics and Stress Analysis - FEA Software ; Fluid Mechanics and Heat Transfer - CFD Software ; General Physics - CFD and/or FEA ; Which Software should I choose?; Application ; Complete Package ; User Interface, Manuals and Training ; Customer Support ; Quality Assurance (QA) ; Maintenance ; Error Reports and Bug Fixes ; Software Performance Testing ; Validation <b
• Edition: 2nd ed
• Publisher Details: Boca Raton : CRC Press
• Publication Date: 2009
• Copyright Date: 2009
• Extent: 1 online resource (xxi, 308 pages), illustrations
• Subjects: 621.381/046; Electronic packaging; TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics; TECHNOLOGY & ENGINEERING -- Electronics -- Digital; Electronic packaging; Elektronikpackning; Electronic books; Electronic books
• Languages: English
• ISBNs: 9781420065404; 1420065408
• Related ISBNs: 9781420065312; 1420065319
• Notes: Note: Includes bibliographical references (pages 295-299) and index.; Note: Print version record.
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.