Semiconductor packaging : materials interaction and reliability /: materials interaction and reliability. (©2012)

• Record Type: Book
• Further Information: Note: Andrea Chen, Randy Hsiao-Yu Lo.
• Other Names: Chen, Andrea; Lo, Randy
• Contents: Section 1. Semiconductor packages -- section 2. Package reliability -- section 3. Materials used in semiconductor packaging -- section 4. The future.
• Publisher Details: Boca Raton, Fla : CRC Press
• Publication Date: 2012
• Copyright Date: 2012
• Extent: 1 online resource (xviii, 198 pages), illustrations
• Subjects: 621.38152 C518; Microelectronic packaging; TECHNOLOGY & ENGINEERING -- Electronics -- Semiconductors; TECHNOLOGY & ENGINEERING -- Electronics -- Solid State; TECHNOLOGY & ENGINEERING -- Electronics -- General; TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- General; TECHNOLOGY & ENGINEERING -- Material Science; Microelectronic packaging; Electronic books
• Languages: English
• ISBNs: 9781439862070; 1439862079; 9781283274609; 1283274604
• Related ISBNs: 9781439862056; 1439862052
• Notes: Note: Includes bibliographical references and index.
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.