Practical guide to the packaging of electronics : thermal and mechanical design and analysis /: thermal and mechanical design and analysis. (2016)

• Record Type: Book
• Further Information: Note: Ali Jamnia.
• Authors: Jamnia, Ali, 1961-
• Contents: Introduction; Issues in Electronics Packaging Design; Technical Management Issues; ; Basic Heat Transfer—Conduction, Convection, and Radiation; Basic Equations and Concepts; General Equations; Nondimensional Groups; ; Conductive Cooling; Introduction; Thermal Resistance; Heat Spreading; Junction-to-Case Resistance; Contact Interface Resistance; 2D or 3D Heat Conduction; ; Radiation Cooling ; Introduction; Factors Influencing Radiation; Examples and Illustrations; Cabinet Surface Temperature; A Few Design Tips; ; Fundamentals of Convection Cooling ; Introduction; Free (or Natural) Convection; Fin Design; Forced Convection; Indirect Flow System Design; ; Combined Modes, Transient Heat Transfer, and Advanced; Materials ; Introduction; Total System Resistance; Time-Dependent Temperature Variation; Advanced Materials and Technologies; ; Basics of Vibration and Its Isolation ; Introduction; Periodic and Harmonic Motions; Free Vibration; Forced Vibration; Random Vibration; Vibrations and Mechanical Stresses Caused by Acoustics and Noise; Multiple DOF Systems; A Few Words on Advanced and Active Isolation Techniques; ; Basics of Shock Management ; Introduction; Pulse Shock Isolation; Velocity Shock Isolation; ; Induced Stresses ; Introduction; Forced Vibration; Random Vibration; Shock Environment; ; The Finite Element Methods ; Introduction; Some Basic Definitions; The FEA Procedure; Finite Element Formulation; Formulation of Characteristic Matrix and Load Vector; Finite Element Formulation of Dynamic Problems; Finite Element Formulation of Heat Conduction ; CAD to FEA Considerations; Criteria for Choosing Engineering Software; Summary; ; Mechanical and Thermomechanical Concerns; Introduction; General Stress–Strain Relationship; Determining Deformations under Application of General Loads; Thermal Strains and Stresses; Thermal Strains and Deflections; Simplifications (or Making Engineering Assumptions); ; Acoustics; Introduction; Noise, Sound, and Their Difference; Governing Equations; Measurement and Standards; Acoustics as a Design Priority; ; Mechanical Failures and Reliability; Introduction; Failure Modes; Life Expectancy; Design Life, Reliability, and Failure Rate; ; Electrical Failures and Reliability ; Introduction; Failure Modes and Mechanism; Life Expectancy of Electronics Assemblies; Design Life, Reliability, and Failure Rate; ; Chemical Attack Failures and Reliability Concerns ; Introduction; Electrochemical Attacks; Migration and Electromigration; ; Reliability Models, Predictions, and Calculations ; Introduction; Basic Definitions; Reliability Models; Device Failure Rate Prediction; System Failure Rate; Reliability Testing; ; Design Considerations in an Avionics Electronic Package ; Introduction; Design Parameters; Analysis; Acknowledgment; ; Appendices; ; References;
• Edition: Third edition
• Publisher Details: Boca Raton : Taylor & Francis, CRC Press
• Publication Date: 2016
• Extent: 1 online resource
• Subjects: 621.381/046; TECHNOLOGY & ENGINEERING / Electronics / Microelectronics; Electronic packaging; Electronic packaging; TECHNOLOGY & ENGINEERING / Mechanical; Electronic books
• Languages: English
• ISBNs: 9781315351087; 1315351080
• Related ISBNs: 9781498753951; 1498753957
• Notes: Note: Includes bibliographical references and index.; Note: Print version record.
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.