Measurement technology for micro-nanometer devices. (2016)

• Record Type: Book
• Further Information: Note: Wendong Zhang [and eight others].
• Authors: Zhang, Wendong; Chou, Xiujian; Shi, Tielin; Ma, Zongmin; Bao, Haifei; Chen, Jing; Chen, Liguo; Li, Dachao; Xue, Chenyang
• Contents: About the Author Preface Chapter 1 Introduction 1 1.1 Micro/Nanotechnology 1 1.1.1 Development of MEMS 1 1.1.2 Development of NEMS 3 1.2 Development of Micro/Nanoscale Measurements 5 1.2.1 Significance 6 1.2.2 Types of micro/nanoscale measurements 6 1.2.3 Conclusion and outlook 7 Chapter 2 Geometry Measurements at Micro/Nanoscale 11 2.1 Microvision Measurements 11 2.1.1 Micro/nanoscale plane geometry parameter tests 12 2.1.2 Integrality tests and analysis of micro/nanometer structures 13 2.1.3 Micro/nanoscale plane dynamic characteristic tests 14 2.2 3d Morphology Measurements with Contact Modes 15 2.2.1 Scanning probe microscopy 15 2.2.2 Near-field scan optics microscopy (NSOM) 22 2.2.3 Scanning electron microscopy 26 2.2.4 Transmission electron microscopy 31 2.3 3d Morphology Optics Measurements with Non-Contact Modes 36 2.3.1 Laser scanning microscopy 37 2.3.2 White light interferometry morphology measurements 39 2.4 Micro/Nanoscale Tricoordinate Measurements 63 2.4.1 Basics 64 2.4.2 Experimental techniques 68 2.5 Measurement of Film Thickness 72 Chapter 3 Dynamic Measurements at the Micro/Nanoscale 82 3.1 Stroboscopic Dynamic Vision Imaging 82 3.1.1 Principles of plane dynamic measurements 83 3.1.2 Equipment 84 3.1.3 Block-matching and phase correlation methods 86 3.1.4 Optical flow field measurement method 89 3.2 Stroboscopic Microscopy Interference Measurements 93 3.2.1 Principles 93 3.2.2 Equipment 94 3.2.3 System 97 3.3 Laser Doppler Microscope Vibration Measurements 98 3.3.1 Differential Doppler vibration measurements 101 3.3.2 Laser torsional vibration measurements 102 3.3.3 Laser Doppler vibration measurements of single torsional vibrations and single bend vibrations 103 3.3.4 Laser Doppler flutter measurements 106 3.4 Conclusion 107 3.4.1 Mechanical processes in AFM 107 3.4.2 Measurement theory and methods of micro/nanometer mechanics in AFM 109 3.4.3 Mico/nano measurement system and reference cantilever measurement method in AFM 116 3.4.4 Measurement of spring constant of cantilever and the system verification 119 3.4.5 Application of AFM to nanometrology 121 Chapter 4 Mechanical Characteristics Measurements 125 4.1 Residual Stress Measurements of Microstructures 126 4.1.1 Residual Stress 126 4.1.2 Measurements 126 4.2 Axial Tensile Measurement 135 4.2.1 Traditional tensile method 136 4.2.2 Conversion tensile method 141 4.2.3 Integrated tensile method 142 4.2.4 Displacement measurement of uniaxial tension 143 4.3 Nano-Indentation Measurements Using Contact Mode 144 4.3.1 Basic principles of nano-indentation technology 145 4.3.2 Nano-indentation measurements 154 4.3.3 Features of nano-indentation technology 155 4.4 Bend Method 156 4.4.1 Principles 156 4.4.2 Micro/nanobeams 159 4.4.3 Advantages and disadvantages of the bend method 162 4.5 Resonance Method 163 4.5.1 Resonance frequency 163 4.5.2 Intrinsic resonance frequency 164 4.6 Stress Measurements Based on Raman Spectroscopy 165 4.6.1 Raman scattering 165 4.6.2 Theory 166 4.6.3 Experimental techniques 167 4.6.4 System 169 4.6.5 Experiments 179 4.6.6 Conclusion and prospects 180 4.7 Bonding Strength Measurements 180 4.7.1 Principles 180 4.7.2 Crack spread method 189 Chapter 5 SPM for MEMS/NEMS Measurements 197 5.1 Introduction 197 5.2 Atomic Force Measurement 198 5.2.1 Atomic force measurement methods 198 5.3 Instruments 206 5.3.1 Schematic of the AFM unit 206 5.3.2 Fiber and sample approach stages 207 5.3.3 Tube scanner 209 5.3.4 Vibration isolation system 211 5.4 Interferometer Detection Method 212 5.4.1 Optical interference theory 212 5.4.2 Interferometer detection 214 5.5 Cantilever and TIP 215 5.6 SPM System 217 5.7 Applications of SFM in Micro/Nano Measurements 219 5.7.1 Three-dimensional (3D) imaging 219 5.7.2 Micro- and nano-electronics 222 5.7.3 Metrology 224 5.7.4 Manipulation and spectroscopy 225 5.8 Conclusion 229 CHAPTER 6 MEMS Online Measurements 235 6.1 Bulk Silicon Micromachining 235 6.1.1 Principles 235 6.1.2 Location platform 236 6.2 Surface Micromachining 243 6.2.1 Surface sacrificial layer microfabrication process 244 6.2.2 Thermal conductivity measurements of polysilicon thin films 247 6.3 Polymer Materials Processing 253 6.3.1 Principles 253 6.3.2 Photosensitive polyimide (PSPI) microvalve 255 Chapter 7 Typical Micro/Nanoscale Device Measurements 263 7.1 Mems Pressure Transducer Measurements 263 7.1.1 Introduction 263 7.1.2 Principles of MEMS pressure transducers 263 7.1.3 Electrical property measurements 269 7.1.4 Static testing of MEMS pressure sensors 274 7.1.5 Dynamic measurements 279 7.1.6 Impact factors of pressure sensor testing 280 7.1.7 Reliability measurements 281 7.2 MEMS Accelerator Measurements 285 7.2.1 Introduction 285 7.2.2 Low- and medium-range accelerator measurements 286 7.2.3 High-g MEMS accelerator measurements 294 7.3 RF-MEMS Testing Technology 306 7.4 Micro/Nanoscale Device Infrared Measurements 314 7.4.1 Infrared imaging systems 315 7.4.2 Infrared imaging measurement 318 7.5 TYPICAL NEMS Device Measurement 321 7.5.1 NEMS accelerometer measurements 322 7.5.2 Working principles of a NEMS acoustic sensor 327 References Index
• Edition: 1st
• Publisher Details: Hoboken, New Jersey : John Wiley & Sons, Inc
• Publication Date: 2016
• Extent: 1 online resource
• Subjects: 681.2; Microtechnology -- Measurement; Nanotechnology -- Measurement; Microelectromechanical systems -- Testing; Physical measurements
• Languages: English
• ISBNs: 9781118717998; 9781118717981; 9781118718001
• Related ISBNs: 9781118717967
• Notes: Note: Description based on CIP data; item not viewed.
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