Materials surface processing by directed energy techniques. (2006)

• Record Type: Book
• Further Information: Note: Edited by Yves Pauleau.
• Other Names: Pauleau, Y; European Materials Research Society.
• Contents: Cover -- Contents -- Preface -- List of Contributors -- Chapter 1. Interaction of Ions and Electrons with Solid Surfaces -- 1.1. Introduction -- 1.2. Ion Bombardment of a Solid -- 1.2.1. Background -- 1.2.2. Thermal Deposition -- 1.2.3. Sputter- or Beam-Assisted Deposition -- 1.2.4. Sputtering -- 1.2.5. Ion Implantation -- 1.2.6. Radiation Damage, Phase Transformation and Ion Beam Mixing -- 1.3. Electron Bombardment of a Solid -- 1.3.1. Elastic Electron Scattering -- 1.3.2. Inelastic Electron Scattering -- 1.3.3. MC Simulation -- References -- Chapter 2. Laser Beam-Solid Interactions: Fundamental Aspects -- 2.1. Introduction -- 2.2. Light Absorption in a Solid: Stage 1 -- 2.2.1. Heating of Target -- 2.2.2. The Initial Material Ejection from the Solid -- 2.3. One-Dimensional Material Ejection during the Laser Pulse: Stage 2 -- 2.3.1. Absorption of Light in the Initial Plume -- 2.3.2. Ionization in the Plume -- 2.3.3. The Knudsen Layer -- 2.3.4. Acceleration of Plume Particles by Space Charge Effects -- 2.4. Three-Dimensional Expansion of the Plume in Vacuum: Stage 3 -- 2.4.1. Anisimov's Expansion Model -- 2.4.2. The Angular Distribution of Ablated Species in Vacuum -- 2.4.3. The Value of the Adiabatic Constant -- 2.4.4. Charge States -- 2.4.5. Plume Expansion from Femtosecond Laser Pulses -- 2.5. Plume Expansion in Background Gases: Stage 4 -- 2.5.1. Film Deposition in a Background Gas -- 2.5.2. From the Vacuum-Like to the Transition Regime: Shock Wave Formation and Plume Splitting -- 2.5.3. Shock Wave and Diffusion: The Third Regime -- 2.5.4. The Angular Distribution in Background Gases -- Acknowledgments -- References -- Chapter 3. Magnetron Discharges for Thin Films Plasma Processing -- 3.1. Introduction -- 3.2. Milestones in Sputtering -- 3.2.1. Sputtering Sources -- 3.2.2. Sputtering Process -- 3.3. General Properties of Magnetron Discharge -- 3.3.1. I-V Characteristics of Magnetrons -- 3.3.2. Magnetron Discharges Sustained at Low Discharge Voltages -- 3.3.3. Discharge of Dual Magnetron -- 3.4. Role of Energy in Formation of Sputtered Films -- 3.4.1. Ion Current Density at Substrate in Sputtering Magnetron Discharge -- 3.4.2. Ion Current Density on Substrate in Cleaning Magnetron Discharge -- 3.4.3. Effect of Deposition Rate a[sub(D)] on Energy E[sub(i)] Delivered to the Growing Film -- 3.4.4. Energy Delivered by Fast Condensing Atoms -- 3.5. Advanced Sputtering Sources and Systems -- 3.5.1. Magnetron with Extended Anode -- 3.5.2. Rectangular Magnetron with Full Target Erosion -- 3.5.3. Cluster of Magnetrons -- 3.6. Conclusions -- Acknowledgments -- References -- Chapter 4. Surface Modification of Materials by Plasma Immersion Ion Implantation -- 4.1. Introduction -- 4.2. PIII and its Classification -- 4.2.1. Gaseous PIII -- 4.2.2. Metal PIII -- 4.3. Low.
• Publisher Details: Amsterdam Boston : Elsevier
• Publication Date: 2006
• Extent: 1 online resource (xxi, 722 pages), illustrations
• Subjects: 620/.44; Surfaces (Technology); Coating processes; Thin films; TECHNOLOGY & ENGINEERING -- Nanotechnology & MEMS; Coating processes; Surfaces (Technology); Thin films; Electronic books
• Languages: English
• ISBNs: 0080458963; 9780080458960
• Related ISBNs: 0080444962
• Notes: Note: Includes bibliographical references and index.; Note: Print version record.
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.