Plasma etching : an introduction /: an introduction. (©1989)

• Record Type: Book
• Further Information: Note: Edited by Dennis M. Manos, Daniel L. Flamm.
• Other Names: Manos, Dennis M; Flamm, Daniel L
• Contents: Front Cover; Plasma Etching: An Introduction; Copyright Page; Table of Contents; Contributors; Preface; Chapter 1. Plasma Etching Technology-An Overview; I. Introduction; II. What Is a Plasma?; III. Processes in a Plasma; IV. Process Requirements and Examples; V. Plasma Reactors; VI. Etching Endpoint Detection; VII. Device Damage from the Plasma; References; Chapter 2. Introduction to Plasma Chemistry; I. Overview; II. How Plasma Etching Takes Place; III. Etching Characteristics and Variables; IV. Etching Silicon in Fluorine Atom Based Plasmas; V. The Loading Effect. VI. The Role of Gas AdditivesVII. Chlorine Plasma Etching; VIII. Etchant-Unsaturate Concepts; IX. Etching Silicon Oxide in Unsaturated and Fluorine-Rich Plasmas; X. Silicon Nitride Etching; XI. Oxygen Plasma Etching of Resists; XII. III-V Etching Chemistries and Mechanisms; Acknowledgment; References; Chapter 3. An Introduction to Plasma Physics for Materials Processing; I. Introduction; II. The Plasma State; III. Single-Particle Motion; IV. Plasma Parameters; V. Discharge Initiation; VI. An Application-The Planar Magnetron; Acknowledgements; References. Chapter 4. Diagnostics of Plasmas for Materials ProcessingI. Introduction; II. Electrostatic (Langmuir) Probes; III. Microwave Interferometry; IV. Impedance Analysis; V. Mass Spectrometry of Plasmas; VI. Emission Spectroscopy; VII. Fluorescence; VIII. Summary; References; Chapter 5. Plasma Etch Equipment and Technology; I. Introduction; II. Classification of Etch Equipment; III. Process Control; IV. Etching Methods-Films; V. Etching Techniques; VI. Other Materials; VII. Discovering and Characterizing Processes; References; Chapter 6. Ion Beam Etching; I. Introduction. II. Broad-Beam Ion SourcesIII. Inert Ion Beam Etching; IV. Reactive Ion Beam Etching; V. Ion Etching Combined with Growth or Deposition; Acknowledgments; References; Chapter 7. Safety, Health, and Engineering Considerations for Plasma Processing; I. Legislated Safety Obligations; II. Response to Safety Legislation; III. Plasma Process Chemistry; IV. Characteristics of Cylinder Gases; V. Hazardous Gas Monitoring Instruments; VI. Checking the Workplace for Hazardous Chemicals; VII. A Hazardous Aluminum Plasma Etch Process; VIII. Plasma Process System Configuration; IX. Recommendations. Appendix A: Comparison of Federal and State OccupationalSafety and Health RequirementsAppendix B: Characteristics of Common Plasma Etch Feeds; References; Index.
• Publisher Details: Boston : Academic Press
• Publication Date: 1989
• Copyright Date: 1989
• Extent: 1 online resource (xii, 476 pages), illustrations
• Subjects: 621.044; Plasma etching; Plasma etching; Gravure par plasma; TECHNOLOGY & ENGINEERING -- Mechanical; Plasma etching; Electronic books
• Languages: English
• ISBNs: 9780080924465; 0080924468
• Related ISBNs: 0124693709; 9780124693708
• Notes: Note: Includes bibliographical references and index.; Note: Print version record.
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.