1. Improvement on the uniformity of deep reactive ion etch for electrically isolated silicon-based substrates. (1st April 2022) Authors: Hu, Xiao; Zhen, Zhihan; Sun, Guotao; Wang, Qingkang; Huang, Qiyu Journal: Journal of micromechanics and microengineering Issue: Volume 32:Number 4(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗