1. High-resolution patterning of silver conductive lines by adhesion contrast planography. (6th August 2015) Authors: Kusaka, Yasuyuki; Koutake, Masayoshi; Ushijima, Hirobumi Journal: Journal of micromechanics and microengineering Issue: Volume 25:Number 9(2015:Sep.) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗