1. Communication—Formation of Porous Cu3Sn by High-Temperature Current Stressing. (1st January 2016) Authors: Lin, C. K.; Chen, Chih; Chu, David T.; Tu, K. N. Journal: ECS journal of solid state science and technology Issue: Volume 5:Number 9(2016) Page Start: P461 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Communication—Formation of Porous Cu3Sn by High-Temperature Current Stressing. (7th July 2016) Authors: Lin, C. K.; Chen, Chih; Chu, David T.; Tu, K. N. Journal: ECS journal of solid state science and technology Issue: Volume 5:Number 9(2016) Page Start: P461 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗