1. Review—Modeling Methods for Analysis of Electromigration Degradation in Nano-Interconnects. (4th March 2021) Authors: Ceric, H.; Selberherr, S.; Zahedmanesh, H.; de Orio, R. L.; Croes, K. Journal: ECS journal of solid state science and technology Issue: Volume 10:Number 3(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗