1. Thermal conductivity of bimetal Al-Cu: molecular dynamics simulation. (31st January 2022) Authors: Junaidi, Syarif; Badawy, Khaled; Hisham, Mohamed; Hussien, Hussien A. Journal: International journal of simulation and process modelling Issue: Volume 17:Number 1(2022) Page Start: 42 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗