1. Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration. Issue 12 (15th April 2016) Authors: Guo, Fu; Liu, Qian; Ma, Limin; Zuo, Yong Journal: Journal of materials research Issue: Volume 31:Issue 12(2016) Page Start: 1793 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗