1. Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding. Issue 16 (15th May 2017) Authors: Zhong, Yi; Zhao, Ning; Dong, Wei; Ma, Haitao; Huang, Mingliang; Yin, Luqiao; Wong, Chingping Journal: Journal of materials research Issue: Volume 32:Issue 16(2017) Page Start: 3128 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗