1. Development of a fast method for optimization of Au ball bond process. Issue 3 (February 2015) Authors: Gomes, J.; Mayer, M.; Lin, B. Journal: Microelectronics and reliability Issue: Volume 55:Issue 3/4(2015) Page Start: 602 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗