1. AI classification of wafer map defect patterns by using dual-channel convolutional neural network. (December 2021) Authors: Chen, Shouhong; Zhang, Yuxuan; Yi, Mulan; Shang, Yuling; Yang, Ping Journal: Engineering failure analysis Issue: Volume 130(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗