1. Effect of bonding parameters on microstructural characteristics during TLP bonding of directionally solidified Ni-based superalloy. (December 2017) Authors: Kim, Jeong Kil; Park, Hae Ji; Shim, Deog Nam; Kim, Dong Jin Journal: Journal of manufacturing processes Issue: Volume 30(2017) Page Start: 208 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗