1. Effects of the hardness and roughness on the plastic deformation properties of electroplated gold bumps during thermocompression bonding. (November 2022) Authors: Elsotohy, M.; Froehlich, J.; Dietrich, L.; Oppermann, H.; Schneider-Ramelow, M. Journal: Microelectronics and reliability Issue: Volume 138(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗