1. A combined modelling approach to design test structures to study thermomigration in Cu interconnects. (November 2022) Authors: Ding, Y.; Lofrano, M.; Varela Pedreira, O.; Zahedmanesh, H.; Croes, K.; De Wolf, I. Journal: Microelectronics and reliability Issue: Volume 138(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗