1. Changes in surface layer of silicon wafers from diamond scratching. Issue 1 (2015) Authors: Zhang, Zhenyu; Wang, Bo; Kang, Renke; Zhang, Bi; Guo, Dongming Journal: CIRP annals Issue: Volume 64:Issue 1(2015) Page Start: 349 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗