1. A single event upset hardened flip-flop design utilizing layout technique. (November 2019) Authors: Wang, Haibin; Chu, Jiamin; Wei, Jinghe; Shi, Junwei; Sun, Hongwen; Han, Jianwei; Qian, Rong Journal: Microelectronics and reliability Issue: Volume 102(2019) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗