1. Design and investigation of a high integrated reliable ceramic package for surface mount technology. (August 2021) Authors: Tang, Lifeng; Wang, Yunyan; Liang, Qiushi; Xia, Qingshui; Zhou, Hao Journal: Microelectronics journal Issue: Volume 114(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗