1. Comparison of ultrasonic wire bonding process between gold and copper by nonlinear structure analysis. Issue 18 (17th September 2018) Authors: Pan, Yongjun; Zhu, Fulong; Lin, Xinxin; Fan, Jiajie; Liu, Sheng Journal: Journal of adhesion science and technology Issue: Volume 32:Issue 18(2018) Page Start: 2007 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗