1. Multistate Degradation Model for Prognostics of Solder Joints Under Vibration Conditions. Issue 4 (1st July 2016) Authors: Tang, Wei; Jing, Bo; Huang, Yifeng; Sheng, Zengjin; Jiao, Xiaoxuan Journal: Chinese journal of electronics Issue: Volume 25:Issue 4(2016) Page Start: 779 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗