1. Multi-scale thermal modeling of glass interposer for mobile electronics application. Issue 3 (3rd May 2016) Authors: Cho, Sangbeom; Sundaram, Venky; Tummala, Rao; Joshi, Yogendra Journal: International journal of numerical methods for heat & fluid flow Issue: Volume 26:Issue 3/4(2016) Page Start: 1157 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗