1. Process optimization for enhancing interconnect performance of large-size BGA component during vibration loading. (March 2022) Authors: Cong, S.; Zhang, W.W.; Liu, P.; Han, Y.N.; Tian, Y.H. Journal: Microelectronics journal Issue: Volume 121(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗